Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

Described herein is a reworkable optically clear adhesive composition comprising: a hot melt adhesive present in an amount of at least about 40 wt. %; a pressure sensitive adhesive present in an amount of at 5 least about 10 wt. %; and titanium dioxide nanoparticles present in an amount of up to about 5 wt. %; wherein the weight percentage of each component is based on the total weight of solids of the adhesive composition. Also described herein is a display for an electronic device comprising the reworkable optically clear adhesive composition and a method of producing the display for an 10 electronic device.

Described herein is a reworkable optically clear adhesive composition comprising: a hot melt adhesive present in an amount of at least about 40 wt. %; a pressure sensitive adhesive present in an amount of at 5 least about 10 wt. %; and titanium dioxide nanoparticles present in an amount of up to about 5 wt. %; wherein the weight percentage of each component is based on the total weight of solids of the adhesive composition. Also described herein is a display for an electronic device comprising the reworkable optically clear adhesive composition and a method of producing the display for an 10 electronic device.

Glue slime activator compositions, kits comprising glue slime activator compositions and a glue or adhesive of appropriate functionality for crosslinking, and methods of making glue slime activator compositions are provided herein.

Glue slime activator compositions, kits comprising glue slime activator compositions and a glue or adhesive of appropriate functionality for crosslinking, and methods of making glue slime activator compositions are provided herein.

The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.

Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WF.sub.6 is provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.

Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WF.sub.6 is provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.