Patent classifications
C09J131/04
UV-curable composition and adhesive film, adhesive tape and bonding member containing the same
The present disclosure relates to a UV-curable composition and adhesive film, adhesive tape and bonding member containing the same. Said UV-curable composition is a UV-curable composition catalyzable by photobase. Said UV-curable composition comprises (1) acrylic polymer and/or ethylene-vinyl acetate copolymer; (2) curable components, comprising polyfunctional mercaptan and polyfunctional epoxy resin; and a (3) photobase generator. The composition of the present disclosure can be coated into an adhesive tape or adhesive film; such adhesive tape or film possesses initial adhesion before UV curing is carried out and can have the strength of a semi-structural adhesive or a structural adhesive after UV curing is carried out.
UV-curable composition and adhesive film, adhesive tape and bonding member containing the same
The present disclosure relates to a UV-curable composition and adhesive film, adhesive tape and bonding member containing the same. Said UV-curable composition is a UV-curable composition catalyzable by photobase. Said UV-curable composition comprises (1) acrylic polymer and/or ethylene-vinyl acetate copolymer; (2) curable components, comprising polyfunctional mercaptan and polyfunctional epoxy resin; and a (3) photobase generator. The composition of the present disclosure can be coated into an adhesive tape or adhesive film; such adhesive tape or film possesses initial adhesion before UV curing is carried out and can have the strength of a semi-structural adhesive or a structural adhesive after UV curing is carried out.
Moisture curable hot melt sealant composition
A moisture curable hot melt sealant composition that includes a silane-modified polyurethane polymer that is free of isocyanate groups, a first rosin-based tackifying agent, a second tackifying agent different from the first rosin-based tackifying agent, a first ethylene vinyl acetate copolymer, a butene component having a weight average molecular weight from 30,000 g/mole to 700,000 g/mole and being selected from the group consisting of polyisobutylene, polyisobutene, polybutene, and combinations thereof; and filler.
Moisture curable hot melt sealant composition
A moisture curable hot melt sealant composition that includes a silane-modified polyurethane polymer that is free of isocyanate groups, a first rosin-based tackifying agent, a second tackifying agent different from the first rosin-based tackifying agent, a first ethylene vinyl acetate copolymer, a butene component having a weight average molecular weight from 30,000 g/mole to 700,000 g/mole and being selected from the group consisting of polyisobutylene, polyisobutene, polybutene, and combinations thereof; and filler.
Adhesive for insulative articles
An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.
Adhesive for insulative articles
An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.
Adhesive for insulative articles
An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.
SEAL FOR BAG FOR CONTAINING A BALE OF COMPRESSIBLE MATERIAL, SEALING PATCH AND METHOD OF SEALING
A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.
Sealing material used as a flexible thin-film type super-capacitor device
Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.
Sealing material used as a flexible thin-film type super-capacitor device
Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.