Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

The present invention relates an emulsifier stabilized formulated copolymer dispersion, processes for forming the emulsifier stabilized formulated copolymer dispersion, and to uses thereof. The emulsifier stabilized formulated copolymer dispersion may be formed by polymerizing at least one monomer in the presence of a stabilizer package, to form an emulsifier stabilizer copolymer dispersion, and introducing a post-addition comprising a polyvinyl alcohol solution to the emulsifier stabilized copolymer dispersion to form an emulsifier stabilized formulated copolymer dispersion. The polyvinyl alcohol, added as solution, may be added in an amount from 1 to 10 % by weight, solid polyvinyl alcohol based on solids content of the emulsifier stabilized copolymer dispersion. The polyvinyl alcohol may have a molecular weight expressed as viscosity from 3 mPa.Math.s to 60 mPa.Math.s based on a 4 % solution at 20° C. and a degree of hydrolysis from 70 mol.% to 85 mol.%, preferably from 78 mol.% to 82 mol.%, more preferably 80 mol.%.

The present invention relates an emulsifier stabilized formulated copolymer dispersion, processes for forming the emulsifier stabilized formulated copolymer dispersion, and to uses thereof. The emulsifier stabilized formulated copolymer dispersion may be formed by polymerizing at least one monomer in the presence of a stabilizer package, to form an emulsifier stabilizer copolymer dispersion, and introducing a post-addition comprising a polyvinyl alcohol solution to the emulsifier stabilized copolymer dispersion to form an emulsifier stabilized formulated copolymer dispersion. The polyvinyl alcohol, added as solution, may be added in an amount from 1 to 10 % by weight, solid polyvinyl alcohol based on solids content of the emulsifier stabilized copolymer dispersion. The polyvinyl alcohol may have a molecular weight expressed as viscosity from 3 mPa.Math.s to 60 mPa.Math.s based on a 4 % solution at 20° C. and a degree of hydrolysis from 70 mol.% to 85 mol.%, preferably from 78 mol.% to 82 mol.%, more preferably 80 mol.%.

A crosslinkable polymer powder compositions redispersible in water includes one or more vinyl ester polymers, one or more compounds bearing epoxide groups and optionally one or more curing agents which crosslink with the compounds bearing epoxide groups. The vinyl ester polymers do not comprise any epoxide-functional monomer units. The crosslinkable polymer powder compositions redispersible in water includes ≥51% by weight, based on the total weight of the vinyl ester polymers, of one or more compounds bearing epoxide groups.

A crosslinkable polymer powder compositions redispersible in water includes one or more vinyl ester polymers, one or more compounds bearing epoxide groups and optionally one or more curing agents which crosslink with the compounds bearing epoxide groups. The vinyl ester polymers do not comprise any epoxide-functional monomer units. The crosslinkable polymer powder compositions redispersible in water includes ≥51% by weight, based on the total weight of the vinyl ester polymers, of one or more compounds bearing epoxide groups.

The present invention refers to co-extrusion of one or more polyolefins with one or more adhesive layers to improve the adhesiveness of the polyolefins in metal, epoxy resin, glass, ceramics, paper, wood, thermoplastic resin, fabric, non-woven fabric, varnishes and formica. More specifically, the present invention refers to a method of co-extruding at least one polyolefin with an adhesive layer, thereby enhancing the adhesion properties of the polyolefin, particularly in polyurethane foams such that a polar surface is imparted to the obtained adhesived polyolefin.

The present invention refers to co-extrusion of one or more polyolefins with one or more adhesive layers to improve the adhesiveness of the polyolefins in metal, epoxy resin, glass, ceramics, paper, wood, thermoplastic resin, fabric, non-woven fabric, varnishes and formica. More specifically, the present invention refers to a method of co-extruding at least one polyolefin with an adhesive layer, thereby enhancing the adhesion properties of the polyolefin, particularly in polyurethane foams such that a polar surface is imparted to the obtained adhesived polyolefin.

Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.

Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.