An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.

An image display panel is disclosed with a bezel including an image display unit and a polarizing film provided on a viewing side of the image display unit via a pressure-sensitive adhesive layer; and a narrow-frame external bezel provided via an elastic intermediate layer, wherein a distance from the viewing-side outermost surface of the image display panel to the pressure-sensitive adhesive layer is 75 μm or more, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

A pressure-sensitive adhesive layer attached optical film is disclosed, including a one-side-protected polarizing film including a thin polarizer and a transparent protective film (excluding a retardation film) on one surface of the polarizer, and the pressure-sensitive adhesive layer is provided on a side of the one-side-protected polarizing film on which the transparent protective film is not provided, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

Pressure-sensitive adhesive material comprising an acrylate dispersion wherein the acrylate dispersion comprises (i) an aqueous acrylate polymer dispersion containing polymers composed of a) acrylate monomers and, optionally, b) ethylenically unsaturated comonomers that are not acrylates, and (ii) modified phylosilicates

A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25° C. so that the adhesive layer is in contact with the copper alloy plate, and the obtained laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes, a 90-degree peeling strength of the temporary protective film against the copper alloy plate is 5 N/m or more at 25° C. before heating the laminate and 150 N/m or less at 50° C. after heating the laminate.

A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25° C. so that the adhesive layer is in contact with the copper alloy plate, and the obtained laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes, a 90-degree peeling strength of the temporary protective film against the copper alloy plate is 5 N/m or more at 25° C. before heating the laminate and 150 N/m or less at 50° C. after heating the laminate.

The present invention relates to aqueous polymer dispersions of polymers made of polymerized ethylenically unsaturated monomers M which comprise or consist of: a) 55 to 88% by weight, based on the total weight of the monomers M, of at least one monomer Ma consisting of a1) at least one monomer Ma(1) selected from alkyl acrylates having a branched alkyl radical having 3 to 20 carbon atoms, alkyl methacrylates having a branched alkyl radical having 5 to 20 carbon atoms, where the homopolymer of monomer Ma(1) has a theoretical glass transition temperature of at most 10° C. and optionally a2) at least one monomer Ma(2) selected from alkyl acrylates having a linear alkyl radical of 2 to 6 carbon atoms; wherein the weight ratio of monomer Ma(2) to Ma(1) is at most 2:1; b) 8 to 30% by weight, based on the total weight of the monomers M, of a monomer Mb, which is a monoethylenically unsaturated carbonitrile; c) 0 to 25% by weight, based on the total weight of the monomers M, of at least one non-ionic monoethylenically unsaturated monomer Me which is different from the monomers Mb and whose homopolymer has a glass transition temperature of at least 60° C.; provided that the total amount of monomer Mb and Me is in the range of 12 to 40% by weight, based on the total weight of the monomers M; d) at most 2.0% by weight, based on the total weight of the monomers M, of one or more monoethylenically unsaturated monomers Md having an acidic group; e) at most 5% by weight, based on the total weight of the monomers M, of at least one ethylenically unsaturated monomer Me which, alone or with a crosslinking agent, has crosslinking effect and which is different from the monomers Ma to Md; f) at most 10% by weight based on the total weight of the monomers M, of at least one non-ionic monoethylenically unsaturated monomer Mf which has a water-solubility of at least 100 g/L and which is different from the monomers Me; provided that the total amount of monomers Md, Me and Mf does not exceed 10% by weight, based on the total weight of the monomers M. The polymers are suitable as polymer adhesives, in particular as polymer adhesives or binders, respectively, in aqueous flooring adhesive compositions.

Disclosed is a composition for non-aqueous secondary battery adhesive layer which comprises a particulate polymer and a binder, wherein the particulate polymer comprises 5% to 50% by mass of a (meth)acrylonitrile monomer unit and 0.1% to 3.5% by mass of a cross-linkable monomer unit. Also disclosed is a non-aqueous secondary battery adhesive layer prepared by using the composition for non-aqueous secondary battery adhesive layer. Also disclosed is a laminate which comprises a substrate and the non-aqueous secondary battery adhesive layer disposed on at least one side of the substrate either directly or indirectly through one or more other layers. Also disclosed is a non-aqueous secondary battery wherein at least one of a positive electrode, a negative electrode, and a separator comprises the non-aqueous secondary battery adhesive layer.

This adhesively-laminated core manufacturing method is a method for manufacturing an adhesively-laminated core by punching a plurality of steel sheet parts while a strip-shaped steel sheet is fed and laminating the steel sheet parts via an adhesive, and includes a step of forming a curing acceleration portion by applying and drying a curing accelerator on one or both surfaces of the strip-shaped steel sheet before a pressing oil is applied, and a step of applying the pressing oil to a surface of the curing acceleration portion.

This adhesively-laminated core manufacturing method is a method for manufacturing an adhesively-laminated core by punching a plurality of steel sheet parts while a strip-shaped steel sheet is fed and laminating the steel sheet parts via an adhesive, and includes a step of forming a curing acceleration portion by applying and drying a curing accelerator on one or both surfaces of the strip-shaped steel sheet before a pressing oil is applied, and a step of applying the pressing oil to a surface of the curing acceleration portion.