Adhesives for use on user-to-mask interfaces of a respiratory mask and methods of preparing the same are provided. The adhesive includes greater than or equal to about 1 wt. % to less than or equal to about 15 wt. % of one or more glycerides; greater than or equal to about 0.50 wt. % to less than or equal to about 5 wt. % of one or more polyacrylates; greater than or equal to about 1 wt. % to less than or equal to about 10 wt. % of one or more polyethers; greater than or equal to about 25 wt. % to less than or equal to about 45 wt. % of one or more N-vinylpyrrolidone polymers; and a balance of water. The method includes forming a first aqueous mixture, forming a second aqueous mixture, and admixing the first aqueous mixture and the second aqueous mixture to form a substantially homogeneous mixture that defines the adhesive.

Adhesives for use on user-to-mask interfaces of a respiratory mask and methods of preparing the same are provided. The adhesive includes greater than or equal to about 1 wt. % to less than or equal to about 15 wt. % of one or more glycerides; greater than or equal to about 0.50 wt. % to less than or equal to about 5 wt. % of one or more polyacrylates; greater than or equal to about 1 wt. % to less than or equal to about 10 wt. % of one or more polyethers; greater than or equal to about 25 wt. % to less than or equal to about 45 wt. % of one or more N-vinylpyrrolidone polymers; and a balance of water. The method includes forming a first aqueous mixture, forming a second aqueous mixture, and admixing the first aqueous mixture and the second aqueous mixture to form a substantially homogeneous mixture that defines the adhesive.

The pressure sensitive adhesive sheet is a sheet shaped pressure sensitive adhesive including an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment, and a content of the urethane-based segment is 3 to 30 parts by weight based on 100 parts by weight of the acryl-based segment. The urethane-based segment includes at least one urethane chain selected from the group consisting of a polyether urethane and a polyester urethane. The content of the urethane-based segment other than the polyether urethane-based segment is 15 parts by weight or less based on 100 parts by weight of the acryl-based segment.

A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.

Described is a process for producing adhesive-coated articles, wherein an aqueous dispersion adhesive composition comprising a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone is applied at high web speed to a film substrate using a coating machine having at least one rotating roller and wherein the coated film substrate may optionally be bonded to a further substrate. Also described is the use of polyvinylpyrrolidone as a defoamer for aqueous dispersion adhesive compositions applied to a film substrate using a coating machine having a rapidly rotating roller.

Described is a process for producing adhesive-coated articles, wherein an aqueous dispersion adhesive composition comprising a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone is applied at high web speed to a film substrate using a coating machine having at least one rotating roller and wherein the coated film substrate may optionally be bonded to a further substrate. Also described is the use of polyvinylpyrrolidone as a defoamer for aqueous dispersion adhesive compositions applied to a film substrate using a coating machine having a rapidly rotating roller.

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.