An adhesive composition, an adhesive film comprising the same, a backplate film comprising the adhesive film, and a plastic organic light emitting display comprising the adhesive film are provided. The adhesive composition includes a (meth)acrylate-based resin; and a polymer having a melting temperature (Tm) of 60? C. or higher, wherein the polymer is a copolymer of a monofunctional polysiloxane and two or more types of monomers.

A UV-curable silicone composition having storage stability and sufficient rapid curability is provided. A resulting cured product of the UV-curable silicone composition has high extensibility, maintains a strong adhesive strength under high temperature and high humidity conditions, and in which discoloration (yellowing) is suppressed, as a curable silicone composition used in an optical display or the like. Also provided is an application of a cured product thereof (OCR or the like). The UV-curable silicone composition comprises (A) a chain-like organopolysiloxane having a specific methacryloyl group-containing organic group, (B) a monofunctional or polyfunctional acrylate compound, and (C) a photopolymerization initiator. The ratio [(a)/(b)] of (a) the number of mols of methacroyl groups and (b) the number of mols of acryloyl groups in the composition is in a range of 0.1 to 3.0.

Phase separated articles that include a matrix phase including an acrylate copolymer; and a silicone elastomer phase stably dispersed in the matrix phase are described. The matrix phase may be derived from precursors comprising from 60 to 95 parts by weight of an alkyl acrylate having an alkyl group having 1 to 14 carbon atoms. Methods of forming phase separated articles, and articles including phase separated articles are also described.

The present invention relates to an adhesive composition capable of improving adhesion force between two interfaces through thermal crosslinking and photo-crosslinking of a substrate and a resin, or a resin and a resin, in processes for optical devices and electronic devices, and a preparation method thereof. Specifically, the present invention relates to an adhesive composition capable of adhering an interface between a substrate and a photocurable resin, and a method of adhering an interface using the same.

An adhesive composition and a composite substrate employing the same are provided. The adhesive composition includes a compound having a structure represented by Formula (I)

(ZY.sub.3XFormula (I)

, wherein X is

##STR00001##

R can be hydrogen, or C.sub.1-6 alkyl group; each Y can be independently a moiety polymerized by at least two different phenol-based compounds; and each Z can be independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group; a thermoplastic elastomer; an epoxy resin; and a bismaleimide.

(A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) ##STR00001##
(R.sup.1 represents a C.sub.1-20 monovalent hydrocarbon group, R.sup.2 represents an oxygen atom or the like, R.sup.3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional (meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2) ##STR00002##
(R.sup.1, R.sup.2, R.sup.3, a, and p are identical to those described above), a R.sup.4.sub.3SiO.sub.1/2 unit (b) (in the formula, R.sup.4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO.sub.4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.

The invention provides a photocurable silicone resin composition having excellent adhesion to cyclic olefin resin films and moldings, a cured film, and a laminate thereof. Provided is a photocurable silicone resin composition for use as a hard coat layer of a cyclic olefin resin film, the photocurable silicone resin comprising: 100 parts by mass of a silicone resin composition (A) prepared by blending a reactive silicone resin (A1) including, as main component, polyorganosilsesquioxane represented by the general formula (1) and having a cage-type structure in the structural unit, [RSiO.sub.3/2].sub.n (1) (wherein R is an organic functional group having a (meth)acryloyl group, and n is 8, 10 or 12), and an unsaturated compound (A2) that contains at least one unsaturated group represented by R.sup.3CR.sup.4CH.sub.2 or CR.sup.4CH.sub.2 in one molecule (wherein R.sup.3 represents an alkylene group, an alkylidene group, or OC(O) group, and R.sup.4 represents a hydrogen atom or an alkyl group).

Disclosed are an acryl-silicone-based hybrid emulsion adhesive composition and a method of preparing the same. Particularly, an acryl-silicone-based hybrid emulsion adhesive composition that includes an acrylic emulsion resin prepared by emulsion polymerization of an acrylic monomer mixture and a seed formed of a reactive silicone resin and thus has high weather resistance and heat resistance and a method of preparing the same are provided.

Provided is an ultraviolet-curable composition containing silicon atoms, wherein the composition has a high ability to adjust the mechanical properties of the cured product thereof, and has excellent workability and high adhesion to a substrate even for solvent-free application. This disclosure provides an ultraviolet-light curable composition and a use thereof. The composition contains: (A) 1-99 parts by mass of a compound having at least one (meth)acryloxy group and hydroxyl group in one molecule and having no silicon atom; (B) 1-99 parts by mass of an organopolysiloxane having at least two alkenyl groups in one molecule and having no ultra-violet-curable functional group; and (C) 0-80 parts by mass of a compound having at least one (meth)acryloxy group in the molecule and having no hydroxyl group, on the basis of 100 parts by mass of the total mass of the composition, and contains substantially no organic solvent in the composition.