An adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator.

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator.

The present invention relates to a polyarylene sulfide resin composition with a low out-gas content, comprising: a polyarylene sulfide; and a phenoxy resin. The polyarylene sulfide resin composition of the present invention exhibits a low out-gas content and excellent tensile strength and metal adhesive strength, and thus can be useful as a resin composition for preparing a product requiring molding precision.

A radiation-sensitive composition for forming an insulation film, includes: at least one polyfunctional compound (A) selected from the group consisting of a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2); a polymer (B) having a group Y that reacts with a maleimide group in the polyfunctional maleimide compound (A-1) or a styryl group in the polyfunctional styryl compound (A-2); and a photopolymerization initiator (C). The group Y is represented by Formula (Y1). In Formula (Y1), R.sup.Y1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, L.sup.Y1 represents a single bond, an alkanediyl group having 1 to 5 carbon atoms, C(O)O, NHC(O)NH, or a group obtained by a combination thereof, and * represents a position bonded to a main chain or a side chain of the polymer (B).

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Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200 C. or higher and has no peak in an area of 160 C. or lower.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200 C. or higher and has no peak in an area of 160 C. or lower.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200 C. or higher and has no peak in an area of 160 C. or lower.

A manufacturing method is provided. The manufacturing method applies a bonding adhesive to at least one of the first surface of the first composite preform component or the first surface of the second composite preform component, and joins the first surface of the first composite preform component to the first surface of the second composite preform component.

A manufacturing method is provided. The manufacturing method applies a bonding adhesive to at least one of the first surface of the first composite preform component or the first surface of the second composite preform component, and joins the first surface of the first composite preform component to the first surface of the second composite preform component.