The instant invention provides a laminating adhesive composition and laminates for flexible packaging made therefrom. The laminating adhesive composition according to the present invention comprises a) a first prepolymer comprising the reaction product of a methylene diphenyl diisocyanate and a first polyol and b) a second prepolymer comprising the reaction product of an isocyanate and a second polyol, wherein the second prepolymer has less than 0.1 weight percent of free isocyanate monomers.

The present invention relates to a method in which an adhesive bond is brought into contact with a supercritical fluid, characterized in that the adhesive bond is based on one or more adhesives comprising crosslinked polymers, where the crosslinked polymers have at least one oxygen atom in the polymer chain and have been crosslinked via urethane bridges or —O—CH.sub.2—CH(OH)—CH.sub.2—O— bridges or molecular chains having corresponding bridges, and in that after bringing the adhesive bond into contact with the supercritical fluid, at least one of the parameters pressure, volume, amount of substance or temperature is changed such that the fluid transitions from the supercritical state into a different state, and also to the use of this method as at least a substep in a method for separating adhesive bonds of components.

The present invention relates to a method in which an adhesive bond is brought into contact with a supercritical fluid, characterized in that the adhesive bond is based on one or more adhesives comprising crosslinked polymers, where the crosslinked polymers have at least one oxygen atom in the polymer chain and have been crosslinked via urethane bridges or —O—CH.sub.2—CH(OH)—CH.sub.2—O— bridges or molecular chains having corresponding bridges, and in that after bringing the adhesive bond into contact with the supercritical fluid, at least one of the parameters pressure, volume, amount of substance or temperature is changed such that the fluid transitions from the supercritical state into a different state, and also to the use of this method as at least a substep in a method for separating adhesive bonds of components.

The invention relates to formulations of aqueous dispersion adhesives based on aqueous polyurethane or polyurethane-urea dispersions, and to the use of the adhesive formulations for the adhesive bonding of foam substrates by the spray coagulation process. The dispersion comprises as disperse phase at least one polymer which after drying is semicrystalline or crystalline and has a melting temperature in the range from 30 to 80° C. and an enthalpy of fusion of ≥35 J/g. The formulation comprises at least one plasticizer and optionally at least one tackifier resin.

The invention relates to formulations of aqueous dispersion adhesives based on aqueous polyurethane or polyurethane-urea dispersions, and to the use of the adhesive formulations for the adhesive bonding of foam substrates by the spray coagulation process. The dispersion comprises as disperse phase at least one polymer which after drying is semicrystalline or crystalline and has a melting temperature in the range from 30 to 80° C. and an enthalpy of fusion of ≥35 J/g. The formulation comprises at least one plasticizer and optionally at least one tackifier resin.

The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of polyester polyurethanes, at least some of which are based on semi-crystalline polyester polyols. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of polyester polyurethanes, at least some of which are based on semi-crystalline polyester polyols. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of a mixture of polyether polyurethanes which are end-capped with at least two monohydric aliphatic alcohols of different chain lengths. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of a mixture of polyether polyurethanes which are end-capped with at least two monohydric aliphatic alcohols of different chain lengths. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

A two-pack polyurethane adhesive for semi-structural and structural adhesive bonds which are applied in melt form and have a high handling strength wherein the two-pack polyurethane adhesive includes a first pack A containing at least one polyester A1 which is solid at room temperature and at least one polyol A2 having a hydroxyl group functionality greater than 2.0, and a second pack B containing polyurethane prepolymers having isocyanate groups.