1) Ionic silylated copolyurethane of formula:

##STR00001##

in which R.sup.1 is a hydrocarbon radical; R.sup.2 is a C2-C4 alkylene; n is an integer such that the molecular mass of —[OR.sup.2].sub.n is 2500-20 000 g/mol; R.sup.∘ is H or C1-C18 alkyl; R, R′ and R″ are a hydrocarbon-based radical; x and y are integers from 1 à 8; z is an integer from 0 to 8; m and q are an integer of greater than or equal to 1, such that q/m ranges from 0.04 to 20; F.sup.1 is a radical of formula (IIa) and F.sup.2 is a radical of formula (IIb):

##STR00002## in which R.sup.3 is methylene or n-propylene; R.sup.4 and R.sup.5 are methyl or ethyl; p is equal to 0 or 1; R.sup.6 is a C1-C4 alkyl.

2) Process for preparing copolyurethane 1), comprising: (i) polyaddition between a polyisocyanate, a polyether diol and a carboxylic diol; (ii) neutralization of the product formed with the amine N(R)(R′)(R″); then (iii) reaction with an aminosilane derived from a secondary amine.

3) Composition, usable as sealant and/or adhesive, comprising copolyurethane 1) and a filler.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

Adhesion promoter compositions, containing: a) between 40 and 80 parts by weight of a binder composition, including i) 20-40 wt % of at least one silane-terminated polyurethane polymer STP, which can be obtained from at least one polyol P, aliphatic polyisocyanate I and organosilane OS1, ii) 4-20 wt % of at least one organosilane OS2 and/or organotitanate OT, iii) 0-3 wt % of at least one desiccant, iv) 40-80 wt % of solvent L1; b) between 0-30 parts by weight of industrial carbon black; c) between 0-1 parts by weight of UV marker; d) so much of solvent L2 that sum of a)-d) is 100 parts by weight; OS1 having secondary amino, mercapto or hydroxyl group on organic moiety and the at least one STP having been produced in absence of OS2, and the at least one P having an average OH functionality of at least 2 and equivalent weight of at most 500.

Adhesion promoter compositions, containing: a) between 40 and 80 parts by weight of a binder composition, including i) 20-40 wt % of at least one silane-terminated polyurethane polymer STP, which can be obtained from at least one polyol P, aliphatic polyisocyanate I and organosilane OS1, ii) 4-20 wt % of at least one organosilane OS2 and/or organotitanate OT, iii) 0-3 wt % of at least one desiccant, iv) 40-80 wt % of solvent L1; b) between 0-30 parts by weight of industrial carbon black; c) between 0-1 parts by weight of UV marker; d) so much of solvent L2 that sum of a)-d) is 100 parts by weight; OS1 having secondary amino, mercapto or hydroxyl group on organic moiety and the at least one STP having been produced in absence of OS2, and the at least one P having an average OH functionality of at least 2 and equivalent weight of at most 500.

Described is a curable composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; a compatibilizer having at least one silane group and at least one epoxy terminal group or at least one nitrogen-containing groups; and optionally a hardening agent; wherein the composition further optionally comprises at least one of a nitrogen-containing unsaturated heterocyclic compound catalyst and a nitrogen-containing phenol catalyst. The curable composition exhibits high hermeticity, fast curing speed, quick adhesion build up, dry surface and strong adhesion strength. A method for applying the curable composition on the surface of a substrate is also provided.

Disclosed herein are methods of making an adhesive composition, the methods comprising providing a polyurethane acrylate and combining with a vinyl ether and co-curing the combination to form an adhesive composition, wherein after curing the adhesive composition has a modulus at −20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. Also disclosed are the resulting adhesive compositions.

Disclosed herein are methods of making an adhesive composition, the methods comprising providing a polyurethane acrylate and combining with a vinyl ether and co-curing the combination to form an adhesive composition, wherein after curing the adhesive composition has a modulus at −20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. Also disclosed are the resulting adhesive compositions.

An embodiment of the present technology is an isocyanate-based adhesive used for a surface-treated crystalline thermoplastic resin base material, the isocyanate-based adhesive having a value represented by (JIS-A hardness)/(strength at break [MPa])×(elongation at break (%))/100 of 2.0 to 70 after being cured by being allowed to stand still under a condition at 23° C. and 50% RH for 3 days, and the crystalline thermoplastic resin base material having a value represented by (δ.sup.d/δ.sup.p+δ.sup.p) of 2.0 to 30.0. δ.sup.p=γ.sup.p−γ.sup.p0 and δ.sup.d=|γ.sup.d−γ.sup.d0|, γ.sup.p0 is a polar term of surface free energy before the surface treatment, γ.sup.p is a polar term of surface free energy after the surface treatment, γ.sup.d0 is a dispersion term of the surface free energy before the surface treatment, and γ.sup.d is a dispersion term of the surface free energy after the surface treatment.

An embodiment of the present technology is an isocyanate-based adhesive used for a surface-treated crystalline thermoplastic resin base material, the isocyanate-based adhesive having a value represented by (JIS-A hardness)/(strength at break [MPa])×(elongation at break (%))/100 of 2.0 to 70 after being cured by being allowed to stand still under a condition at 23° C. and 50% RH for 3 days, and the crystalline thermoplastic resin base material having a value represented by (δ.sup.d/δ.sup.p+δ.sup.p) of 2.0 to 30.0. δ.sup.p=γ.sup.p−γ.sup.p0 and δ.sup.d=|γ.sup.d−γ.sup.d0|, γ.sup.p0 is a polar term of surface free energy before the surface treatment, γ.sup.p is a polar term of surface free energy after the surface treatment, γ.sup.d0 is a dispersion term of the surface free energy before the surface treatment, and γ.sup.d is a dispersion term of the surface free energy after the surface treatment.