Provided herein are a fabric-based substrate and an organic electronic device including the same. The fabric-based substrate includes a fabric layer having an upper surface and a lower surface. A plurality of electrodes are disposed on the upper surface of the fabric layer. An adhesive layer is provided on the upper surface and the lower surface of the fabric layer and filled at least some empty regions between the electrodes and the fabric layer, between the electrodes, and at least some pores in the fabric layer. A self-healing polymer layer is disposed on the adhesive layer located on the lower surface of the fabric layer.

An object of the present invention is to provide a urethane adhesive composition excellent in adhesion durability for an olefin resin. The present invention is a urethane adhesive composition containing a urethane prepolymer having an isocyanate group, an isocyanurate compound of pentamethylene diisocyanate and/or hexamethylene diisocyanate, and a secondary aminosilane compound.

Disclosed is a semi-crystalline polyester polyol having an acid number less than 4 and derived from a saturated fatty component having a hydroxyl number less than 2, the saturated fatty component being selected from the group consisting of saturated fatty acid, saturated fatty acid ester, saturated oil, and combinations thereof, polyhydric alcohol that includes at least three hydroxyl groups, and a dibasic acid.

Disclosed are UV curable adhesive compositions and methods to adhere polycarbonate substrates containing UV absorbers to glass for use in ophthalmic lenses.

Disclosed are UV curable adhesive compositions and methods to adhere polycarbonate substrates containing UV absorbers to glass for use in ophthalmic lenses.

In various embodiments, a resin composition includes a urethane (meth)acrylate, a reactive diluent, and a urethane (meth)acrylate toughener. The urethane (meth)acrylate toughener includes at least one additional polyol having a number average molecular weight Mn of greater than 1,000 g/mol. Cured articles made from the resin composition have an average fracture toughness (K.sub.Ic) value from 1 MPa*m.sup.1/2 to 3 MPa*m.sup.1/2 when measured in accordance with ASTM D5045. Processes for making the resin composition as well as processes using the resin composition are also provided.

In various embodiments, a resin composition includes a urethane (meth)acrylate, a reactive diluent, and a urethane (meth)acrylate toughener. The urethane (meth)acrylate toughener includes at least one additional polyol having a number average molecular weight Mn of greater than 1,000 g/mol. Cured articles made from the resin composition have an average fracture toughness (K.sub.Ic) value from 1 MPa*m.sup.1/2 to 3 MPa*m.sup.1/2 when measured in accordance with ASTM D5045. Processes for making the resin composition as well as processes using the resin composition are also provided.

A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time. The thermosetting conductive adhesive according to the present invention includes components (A) to (D): component (A): a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B): a monofunctional (meth)acrylate monomer; component (C): an organic peroxide; and component (D): conductive particles, in which when the component (A) is an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, the component (B) is a monofunctional acrylate monomer.

A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time. The thermosetting conductive adhesive according to the present invention includes components (A) to (D): component (A): a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B): a monofunctional (meth)acrylate monomer; component (C): an organic peroxide; and component (D): conductive particles, in which when the component (A) is an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, the component (B) is a monofunctional acrylate monomer.

The present application relates to an adhesive composition, an adhesive film, an adhesive optical filter and a display device.