A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

Non-sensitizing pressure sensitive adhesives which are useful in medical applications and other uses where an adhesive is in contact with skin are obtained by energy-curing compositions containing one or more acrylate-functionalized compounds and possibly other components which are selected such that the cured adhesive passes an in vitro cytotoxicity test in accordance with ISO 10993-5 (2009).

Non-sensitizing pressure sensitive adhesives which are useful in medical applications and other uses where an adhesive is in contact with skin are obtained by energy-curing compositions containing one or more acrylate-functionalized compounds and possibly other components which are selected such that the cured adhesive passes an in vitro cytotoxicity test in accordance with ISO 10993-5 (2009).

A laminate including a base material and a resin layer provided on at least one surface of the base material. The resin layer is formed of a heat- or active energy ray-curable resin composition, and an outermost surface of the laminate on the one surface side of the base material has an unevenness containing a wrinkle structure.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

The invention relates to a polyurethane bone-tendon graft biomaterial and method of making the bone-tendon graft biomaterial. The biomaterial has a gradient of mechanical properties through photocrosslinking such that a first end of the biomaterial is crosslinked at a higher degree than a second end, and the first end of the biomaterial has mechanical properties of bone and the second end of the biomaterial has mechanical properties of tendon.

The invention relates to a polyurethane bone-tendon graft biomaterial and method of making the bone-tendon graft biomaterial. The biomaterial has a gradient of mechanical properties through photocrosslinking such that a first end of the biomaterial is crosslinked at a higher degree than a second end, and the first end of the biomaterial has mechanical properties of bone and the second end of the biomaterial has mechanical properties of tendon.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.