Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.

Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.

Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.

The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPa.Math.s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.

The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPa.Math.s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

Provided is a low temperature rapid curing type low elastic conductive adhesive which is useful as a conductive adhesive for component mounting in a field of FHE. A conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

Provided is a low temperature rapid curing type low elastic conductive adhesive which is useful as a conductive adhesive for component mounting in a field of FHE. A conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

The invention is directed to a toughener for epoxy adhesives, the toughener being a reaction product of a bisphenolic blocked PU toughener with a diglycidyl ether-bisphenol product such as liquid DGEBA. The invention includes adhesives comprising the inventive tougheners, methods of using the tougheners and adhesives comprising them, as well as cured inventive adhesives and products comprising them.