The invention relates to a use of at least one condensation product (A) in the form of the free compound or in the form of a salt of at least one acid as a thixotropy-increasing additive, which condensation product can be obtained by reacting at least one polymerized fatty acid or at least one reaction product (U) of at least two polymerized fatty acids and at least one polyamine having at least two primary amino groups as component (a1) with at least one polyalkylene polyamine, which is capable of forming at least one imidazoline and/or tetrahydropyrimidine unit and which has at least two primary amino groups or at least one primary and at least one secondary amino group, a composition containing at least one such condensation product (A) and at least one thixotropic agent (B), and a use of said composition, which additionally comprises at least one binder (C), as an adhesive, sealant, paint, coating agent, adhesive resin, casting resin, artificial marble, floor covering, polymer concrete, or fiber composite material.

The invention relates to a use of at least one condensation product (A) in the form of the free compound or in the form of a salt of at least one acid as a thixotropy-increasing additive, which condensation product can be obtained by reacting at least one polymerized fatty acid or at least one reaction product (U) of at least two polymerized fatty acids and at least one polyamine having at least two primary amino groups as component (a1) with at least one polyalkylene polyamine, which is capable of forming at least one imidazoline and/or tetrahydropyrimidine unit and which has at least two primary amino groups or at least one primary and at least one secondary amino group, a composition containing at least one such condensation product (A) and at least one thixotropic agent (B), and a use of said composition, which additionally comprises at least one binder (C), as an adhesive, sealant, paint, coating agent, adhesive resin, casting resin, artificial marble, floor covering, polymer concrete, or fiber composite material.

The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.

The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.

The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.