A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst.

A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst.

The present invention relates to a polyamide composition comprising a polyamide which is the poly condensation product of an acid component and an amine component, the acid component comprising, per mole of acid component; 30 to 50 mol. % of fatty acid dimer(s); 30 to 50 mol. % of aliphatic dibasic acid(s); 0 to 10 mol. % of chain limiter(s); the amine component comprising, per mole of amine component; 10 to 40 mol. % of cycloaliphatic diamine(s); and 50 to 80 mol. % of aliphatic diamine(s) comprising 3 to 12 carbon atoms); 0 to 15 mol. % of polyetheramine(s); said polyamide composition having; a viscosity less than or equal to 4 Pa.Math.s at 185 C.; and a softening temperature ranging from 150 C. to 170 C.

Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of plasticizers and non-aqueous organic solvents. Also provided is a method of forming a laminate adhesion between two substrates. The disclosure also describes a laminate structure comprising first and second substrates laminated together by the lamination adhesive, the lamination adhesive including a mixture of a polyamide and a copolymer of ethylene and acrylic acid.

Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of plasticizers and non-aqueous organic solvents. Also provided is a method of forming a laminate adhesion between two substrates. The disclosure also describes a laminate structure comprising first and second substrates laminated together by the lamination adhesive, the lamination adhesive including a mixture of a polyamide and a copolymer of ethylene and acrylic acid.

Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of plasticizers and non-aqueous organic solvents. Also provided is a method of forming a laminate adhesion between two substrates. The disclosure also describes a laminate structure comprising first and second substrates laminated together by the lamination adhesive, the lamination adhesive including a mixture of a polyamide and a copolymer of ethylene and acrylic acid.

The invention relates to a hot-melt adhesive composition comprising: i) at least one specific semicrystalline aliphatic copolyamide, ii) at least one filler, the content of carbon atoms of which is between 60% and 100% relative to the number of atoms constituting the filler, the carbon-based filler having a D90 median average particle size ranging from 1 to 400 micrometers, iii) at least one electrically insulating filler chosen from oxides of metals and nitrides, the sum of the contents of carbon-based filler and of electrically insulating filler is between 30% and 75% by weight relative to the total weight of the composition, said fillers having a D90 median average particle size ranging from 1 to 400 micrometers.

The invention also relates to a process for the preparation thereof and to the use thereof.

The invention relates to a hot-melt adhesive composition comprising: i) at least one specific semicrystalline aliphatic copolyamide, ii) at least one filler, the content of carbon atoms of which is between 60% and 100% relative to the number of atoms constituting the filler, the carbon-based filler having a D90 median average particle size ranging from 1 to 400 micrometers, iii) at least one electrically insulating filler chosen from oxides of metals and nitrides, the sum of the contents of carbon-based filler and of electrically insulating filler is between 30% and 75% by weight relative to the total weight of the composition, said fillers having a D90 median average particle size ranging from 1 to 400 micrometers.

The invention also relates to a process for the preparation thereof and to the use thereof.

The present invention relates to thermoplastic hotmelt adhesive compositions comprising a flame-retardant mixture, a process for producing the compositions as well as their use in low-temperature pressure molding.

The present invention relates to thermoplastic hotmelt adhesive compositions comprising a flame-retardant mixture, a process for producing the compositions as well as their use in low-temperature pressure molding.