The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing:

(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms;

(B) an epoxy resin having at least two epoxy groups in one molecule; and

(C) a reaction promoter,

wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing:

(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms;

(B) an epoxy resin having at least two epoxy groups in one molecule; and

(C) a reaction promoter,

wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

An electrode binder, a cathode electrode material, and a lithium ion battery are disclosed. The electrode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. The cathode electrode material includes a cathode active material, a conducting agent, and the electrode binder. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the cathode electrode comprising a cathode active material, a conducting agent, and the electrode binder.

An electrode binder, a cathode electrode material, and a lithium ion battery are disclosed. The electrode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. The cathode electrode material includes a cathode active material, a conducting agent, and the electrode binder. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the cathode electrode comprising a cathode active material, a conducting agent, and the electrode binder.

Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains: (A) 100 parts by mass of a maleimide compound having at least two maleimide groups in one molecule, having a number average molecular weight of greater than 4,000, and having at least one divalent organic group selected from a dimer acid skeleton, a linear alkylene group having not less than 6 carbon atoms, and a linear alkenylene group having not less than 6 carbon atoms; (B) 0.1 to 15 parts by mass of an epoxy resin having at least two epoxy groups in one molecule; and (C) 0.1 to 5 parts by mass of a diaminotriazine ring-containing imidazole.

Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains: (A) 100 parts by mass of a maleimide compound having at least two maleimide groups in one molecule, having a number average molecular weight of greater than 4,000, and having at least one divalent organic group selected from a dimer acid skeleton, a linear alkylene group having not less than 6 carbon atoms, and a linear alkenylene group having not less than 6 carbon atoms; (B) 0.1 to 15 parts by mass of an epoxy resin having at least two epoxy groups in one molecule; and (C) 0.1 to 5 parts by mass of a diaminotriazine ring-containing imidazole.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

An adhesive film with excellent cuttability with respect to both a base layer and a surface layer or layers laminated thereon is provided, without significant formation of adhesive burrs in various shearing processes. The adhesive film includes a support member and an adhesive layer laminated on at least one side of the support member. The adhesive layer has a laminate structure having a base layer made of a resin-based adhesive and laminated on the surface of the support member and a surface layer made of a resin-based adhesive and laminated on the base layer. The base layer is non-directional and has lengthwise and widthwise shearing strengths of 2 g to 2000 g [200 mm/min, 25 mm] in the thickness range of 2 μm to 60 μm. The base layer has a shearing strength of 1.5 to 200 times the shearing strength of the surface layer.