A laminate containing: an adhesion layer-applied substrate containing a substrate and an adhesion layer disposed on the substrate, the adhesion layer containing an adhesive emulsion particle (F), an inorganic oxide (G) and a light-shielding agent (S1); and a hard coating layer (C) disposed on the adhesion layer-applied substrate and containing a matrix component (B) containing an inorganic oxide (D), wherein a haze value H1 of the adhesion layer-applied substrate is larger than a haze value H2 of the laminate.

The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.

The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.

A structure includes an aluminum base and an adhesive layer that is made of an adhesive resin adhering to a surface of the aluminum base. The adhesive layer includes a hard layer that abuts against an adhesive interface where the hard layer is adhered to the aluminum base, and a body layer that abuts against the hard layer. The hard layer is harder than the body layer.

Curable compositions of this disclosure comprise a mixture of: a silanol, a free radical initiator, an iodonium salt; and optionally an alkoxysilane, and/or an MQ resin, and/or (meth)acrylate monomer(s). In another aspect, cured compositions of this disclosure comprise: a cured silicone, a free radical initiator or residue thereof, an iodonium salt or residue thereof; and optionally a poly(meth)acrylate and/or an MQ resin, which may comprise the cured silicone. In another aspect, cured compositions of this disclosure comprise: a continuous phase of cured silicone, a discontinuous phase of poly(meth)acrylate inclusions, and optionally an MQ resin, which may comprise the cured silicone. The poly(meth)acrylate inclusions may have an average diameter of less than 1.0 micrometer or smaller. The compositions may be pressure sensitive adhesives. The curable and cured compositions may be solvent-free.

Curable compositions of this disclosure comprise a mixture of: a silanol, a free radical initiator, an iodonium salt; and optionally an alkoxysilane, and/or an MQ resin, and/or (meth)acrylate monomer(s). In another aspect, cured compositions of this disclosure comprise: a cured silicone, a free radical initiator or residue thereof, an iodonium salt or residue thereof; and optionally a poly(meth)acrylate and/or an MQ resin, which may comprise the cured silicone. In another aspect, cured compositions of this disclosure comprise: a continuous phase of cured silicone, a discontinuous phase of poly(meth)acrylate inclusions, and optionally an MQ resin, which may comprise the cured silicone. The poly(meth)acrylate inclusions may have an average diameter of less than 1.0 micrometer or smaller. The compositions may be pressure sensitive adhesives. The curable and cured compositions may be solvent-free.

An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis acid to catalyze cure of the epoxy-groups. The composition can be coated on various substrates and cured to form a release liner.

The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.