Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

The present disclosure relates to self-sealing tires, a process for making said self-sealing tires and the use of a silicone composition cured via a condensation cure chemistry to form a self-sealing layer designed to function as both (i) a self-sealing tire puncture material, i.e., to seal puncture holes in the tread region of tires if/when punctured by a foreign body and (ii) as an adhesive for sound-absorbing foams adapted to reduce the noise generated by tires during travel.

The present disclosure relates to self-sealing tires, a process for making said self-sealing tires and the use of a silicone composition cured via a condensation cure chemistry to form a self-sealing layer designed to function as both (i) a self-sealing tire puncture material, i.e., to seal puncture holes in the tread region of tires if/when punctured by a foreign body and (ii) as an adhesive for sound-absorbing foams adapted to reduce the noise generated by tires during travel.

A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm.sup.2 in separation load evaluation and/or a total separation load of not more than 0.018 N.Math.mm per mm.sup.2.

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm.sup.2 in separation load evaluation and/or a total separation load of not more than 0.018 N.Math.mm per mm.sup.2.

The present invention discloses a moisture and radiation curable adhesive composition and the use thereof, in particular, to a moisture and radiation curable adhesive composition used as a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

The present invention discloses a moisture and radiation curable adhesive composition and the use thereof, in particular, to a moisture and radiation curable adhesive composition used as a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

The present invention discloses a moisture and radiation curable adhesive composition and the use thereof, in particular, to a moisture and radiation curable adhesive composition used as a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

A curable organopolysiloxane composition contains: (A) 100 mass parts of a functional organopolysiloxane component having at least one radical curable group selected from an acrylate group and a methacrylate group and optionally one or more alkoxysilyl groups; (B) 0 to 100 mass parts of a condensation curable organo polysiloxane component; (C) one to 10 mass parts of tetraalkoxysilanes or a hydrolyate of the tetraalkoxysilanes; and optionally one or more of (D) a radical initiator, (E) a condensation catalyst, (F) fillers, (G) adhesion promoters, (H) pigments, (I) a non-reactive organopolysiloxane, and (J) inhibitors.