The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20, the component (A) being a silane compound (co)polymer that is represented by a formula (a-1) or a formula (a-2),

(CHR.sup.1X.sup.0-D-SiO.sub.3/2).sub.m(R.sup.2SiO.sub.3/2).sub.n(CHR.sup.1X.sup.0-D-SiZ.sup.1O.sub.2/2).sub.o(R.sup.2SiZ.sup.2O.sub.2/2).sub.p(CHR.sup.1X.sup.0-D-SiZ.sup.3.sub.2O.sub.1/2).sub.q(R.sup.2SiZ.sup.4.sub.2O.sub.1/2).sub.r   (a-1)

(R.sup.3SiO.sub.3/2).sub.s(R.sup.3SiZ.sup.5O.sub.2/2).sub.t(R.sup.3SiZ.sup.5.sub.2O.sub.1/2).sub.u   (a-2) the component (B) being fine particles having an average primary particle size of more than 0.04 μm and 8 μm or less, the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule, and the component (D) being a silane coupling agent that comprises an acid anhydride structure in its molecule, and an optical element-securing composition, and a cured product, and an optical element-securing material, and a method for using the curable composition, and an optical device.

Disclosed herein is a method of attaching a medical device to a surface, the medical device having at least one adhesive area, wherein the method comprises the steps of: contacting the surface with a composition comprising a T silicone resin and/or a DT silicone resin and/or an MQ silicone resin and/or an MT silicone resin, thereby providing non-tacky coating on the surface; and attaching the adhesive area to the surface such that the composition is located between, and in contact with, the surface and the adhesive area, thereby attaching medical device to the surface; thereby achieving an improve adherence between the medical device and the surface.

Disclosed herein is a method of attaching a medical device to a surface, the medical device having at least one adhesive area, wherein the method comprises the steps of: contacting the surface with a composition comprising a T silicone resin and/or a DT silicone resin and/or an MQ silicone resin and/or an MT silicone resin, thereby providing non-tacky coating on the surface; and attaching the adhesive area to the surface such that the composition is located between, and in contact with, the surface and the adhesive area, thereby attaching medical device to the surface; thereby achieving an improve adherence between the medical device and the surface.

A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture.

Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.

A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture.

Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.

Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein are lamps comprising a lamp body and a front lens utilizing the adhesive composition to adhere the front lens to the lamp body while generally preserving the integrity of the anti-haze coating.

Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein are lamps comprising a lamp body and a front lens utilizing the adhesive composition to adhere the front lens to the lamp body while generally preserving the integrity of the anti-haze coating.

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.

A method for manufacturing a semiconductor device includes: bonding at least a part of the rear surface of a semiconductor wafer, and a supporting substrate in use of using a silane coupling agent; forming a functional structure on a front surface of the semiconductor wafer; placing a condensation point of laser light transmitted through the semiconductor wafer on a bonding interface between the semiconductor wafer and the supporting substrate, and irradiating the bonding interface with the laser light, thereby forming a fracture layer on at least a part of an outer circumferential section of the bonding interface; separating the bonding interface; and carrying out rear surface processing on the rear surface of the semiconductor wafer.

A method for manufacturing a semiconductor device includes: bonding at least a part of the rear surface of a semiconductor wafer, and a supporting substrate in use of using a silane coupling agent; forming a functional structure on a front surface of the semiconductor wafer; placing a condensation point of laser light transmitted through the semiconductor wafer on a bonding interface between the semiconductor wafer and the supporting substrate, and irradiating the bonding interface with the laser light, thereby forming a fracture layer on at least a part of an outer circumferential section of the bonding interface; separating the bonding interface; and carrying out rear surface processing on the rear surface of the semiconductor wafer.