The present invention is directed to a one-component (1K) moisture curable composition comprising: (a) at least one polyorganosiloxane which has at least one alkoxy group bound to a silicon atom, (b) at least one alkoxy-containing aminofunctional silicone resin, (c) at least one adhesion promoter different from said alkoxy-containing aminofunctional silicone resin (b), and (d) at least one curing catalyst. The invention also relates to coatings, sealants, or adhesives comprising said composition, cured products obtained from said composition, use of the composition.

The present invention is directed to a one-component (1K) moisture curable composition comprising: (a) at least one polyorganosiloxane which has at least one alkoxy group bound to a silicon atom, (b) at least one alkoxy-containing aminofunctional silicone resin, (c) at least one adhesion promoter different from said alkoxy-containing aminofunctional silicone resin (b), and (d) at least one curing catalyst. The invention also relates to coatings, sealants, or adhesives comprising said composition, cured products obtained from said composition, use of the composition.

The use of an organocarbonate-modified prepolymer having at least an average of 1.5 carbonate, thiocarbonate, carbamate or thiocarbamate groups bonded directly to the polymer backbone each via an oxygen atom, where each of these oxygen atoms has its origin in the reaction of a primary, secondary or tertiary hydroxyl group of the polymer backbone and a reactive compound selected from the group consisting of a diorganocarbonate, a diorganothiocarbonate, a cyclic carbonate, a cyclic thiocarbonate, an N,N-diheterocyclourea derivative and an N,N-diheterocyclothiourea derivative. Also, the preparation of the alkoxysilane polymers.

Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene group-containing organosilicon compound exhibits satisfactorily fast curability and excellent safety even when an amine compound is used as a curing catalyst ##STR00001##
(In the formula, each R.sup.1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 and group, each R.sup.2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R.sup.3 independently represents an unsubstituted or substituted C1-10 alkyl group, or a hydrogen atom. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.)

Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene group-containing organosilicon compound exhibits satisfactorily fast curability and excellent safety even when an amine compound is used as a curing catalyst ##STR00001##
(In the formula, each R.sup.1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 and group, each R.sup.2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R.sup.3 independently represents an unsubstituted or substituted C1-10 alkyl group, or a hydrogen atom. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.)

Provided is a fluorosilicone resin and a preparation method thereof. Using pentafluorostyrene as raw material, pentafluorophenethyldimethylchlorosilane is prepared by a hydrosilylation reaction. By means of a polycondensation reaction of the pentafluorophenethyldimethylchlorosilane, trimethylchlorosilane and tetraethyl orthosilicate, a pentafluorophenyl silicone resin is prepared. The preparation method adopts a two-step polycondensation process, which overcomes the disadvantages of a large difference in hydrolysis reactivity between pentafluorophenyldimethylchlorosilane and a copolymerized trialkyl-chlorosilane, and achieves a high yield. The obtained pentafluorophenyl silicone resin has the advantages of superior heat resistance, simple preparation process, low equipment requirements, high availability of raw material, and suitability for mass production. The heat-resistant fluorosilicone resin can be applied in a polymer material, such as a heat-resistant adhesive.

Provided is a fluorosilicone resin and a preparation method thereof. Using pentafluorostyrene as raw material, pentafluorophenethyldimethylchlorosilane is prepared by a hydrosilylation reaction. By means of a polycondensation reaction of the pentafluorophenethyldimethylchlorosilane, trimethylchlorosilane and tetraethyl orthosilicate, a pentafluorophenyl silicone resin is prepared. The preparation method adopts a two-step polycondensation process, which overcomes the disadvantages of a large difference in hydrolysis reactivity between pentafluorophenyldimethylchlorosilane and a copolymerized trialkyl-chlorosilane, and achieves a high yield. The obtained pentafluorophenyl silicone resin has the advantages of superior heat resistance, simple preparation process, low equipment requirements, high availability of raw material, and suitability for mass production. The heat-resistant fluorosilicone resin can be applied in a polymer material, such as a heat-resistant adhesive.

The application provides a product with a protective coating and a manufacturing method thereof. Prepare a first precursor dispersion comprising a first active organic precursor, and the first active organic precursor is a fluorine-free monomer. Prepare a second precursor dispersion comprising a second active organic precursor, and the second active organic precursor is a fluorine-containing monomer. Apply the first precursor dispersion to a product body, and dry the applied first precursor dispersion to form a first dried layer. Apply the second precursor dispersion to the first dried layer to cover the first dried layer, and dry the applied second precursor dispersion to form a second dried layer, so that the first active organic precursor and the second active organic precursor are polymerized to obtain a product with a protective coating.

The application provides a product with a protective coating and a manufacturing method thereof. Prepare a first precursor dispersion comprising a first active organic precursor, and the first active organic precursor is a fluorine-free monomer. Prepare a second precursor dispersion comprising a second active organic precursor, and the second active organic precursor is a fluorine-containing monomer. Apply the first precursor dispersion to a product body, and dry the applied first precursor dispersion to form a first dried layer. Apply the second precursor dispersion to the first dried layer to cover the first dried layer, and dry the applied second precursor dispersion to form a second dried layer, so that the first active organic precursor and the second active organic precursor are polymerized to obtain a product with a protective coating.

Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.