The use of an amidine of formula (I) and/or a conversion product thereof as a catalyst for the crosslinking of a composition based on silane group-containing polymers. The amidine of formula (I) and the conversion products thereof are essentially odorless at room temperature and non-volatile and accelerate the crosslinking of the composition very well without impairing the storage stability of the composition, and are very compatible in the composition. As a result, the compositions do not have a tendency to separate, migrate or evaporate the catalyst.

The use of an amidine of formula (I) and/or a conversion product thereof as a catalyst for the crosslinking of a composition based on silane group-containing polymers. The amidine of formula (I) and the conversion products thereof are essentially odorless at room temperature and non-volatile and accelerate the crosslinking of the composition very well without impairing the storage stability of the composition, and are very compatible in the composition. As a result, the compositions do not have a tendency to separate, migrate or evaporate the catalyst.

The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

A composition curing upon exposure to moisture comprises (A) one or more at least bifunctional silane compounds with at least two alkoxysilane groups, (B) at least one monofunctional silane compound with only one alkoxysilane group, and/or a partially condensed or bridged derivative thereof, and (C) at least one acid generator which, upon exposure to actinic radiation or heat, releases an acid. In addition, further additives (D) may be contained in the compositions according to the present invention. The composition is liquid at room temperature and, apart from the latent acid generator, does not contain any further catalysts for moisture-curing of alkoxysilanes. After activation of the acid generator the composition cures in the presence of moisture, while remaining liquid at room temperature in the presence of humidity over a period of at least 24 hours prior to activation of the acid generator. Furthermore, a method of joining or casting structural elements using the composition is described.

Silicone-polyether copolymers, adhesives and medical articles comprising same, and methods of making same. The silicone-polyether copolymer composition can include a backbone composition having a first (silicone) segment and a second (polyether) segment connected randomly via at least one of an oxamide linkage and a urea linkage. The method of making the silicone-polyether copolymer composition can include combining: a) a first (silicone) precursor; b) a second (polyether) precursor; and c) at least one of a diisocyanate and an oxalate compound.

Silicone-polyether copolymers, adhesives and medical articles comprising same, and methods of making same. The silicone-polyether copolymer composition can include a backbone composition having a first (silicone) segment and a second (polyether) segment connected randomly via at least one of an oxamide linkage and a urea linkage. The method of making the silicone-polyether copolymer composition can include combining: a) a first (silicone) precursor; b) a second (polyether) precursor; and c) at least one of a diisocyanate and an oxalate compound.

An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modifier, etc. ##STR00001##
(In the formula, the R.sup.1 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.2 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.3 moieties each independently represent a hydrogen atom or a methyl group; A.sup.1 represents a single bond, O, S, NH, or a divalent linking group containing a heteroatom; A.sup.2 represents a single bond or an (un)substituted C.sub.1-20 divalent hydrocarbon group optionally containing a heteroatom; a and c are each independently a number greater than 0; b, d, e, and f are each independently a number of 0 or greater; and m is an integer of 1 to 3. The repeating units may have been linked in any order.)

An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modifier, etc. ##STR00001##
(In the formula, the R.sup.1 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.2 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.3 moieties each independently represent a hydrogen atom or a methyl group; A.sup.1 represents a single bond, O, S, NH, or a divalent linking group containing a heteroatom; A.sup.2 represents a single bond or an (un)substituted C.sub.1-20 divalent hydrocarbon group optionally containing a heteroatom; a and c are each independently a number greater than 0; b, d, e, and f are each independently a number of 0 or greater; and m is an integer of 1 to 3. The repeating units may have been linked in any order.)

A curable perfluoropolyether adhesive composition including: (A) a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by C.sub.aF.sub.2aO in a main chain, wherein a represents an integer of 1 to 6: 100 parts by mass; (B) a fluorine-containing organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule: an effective curing amount; and (C) a hydrosilylation-reaction catalyst: a catalytic amount. The curable perfluoropolyether adhesive composition does not contain any organic solvent in the composition. This provides a curable perfluoropolyether adhesive composition that produces a cured product with excellent heat resistance, weather resistance, water repellency, oil repellency, chemical resistance, solvent resistance, etc., and particularly free of voids that may otherwise occur on the coating film surface during heating processes, as well as an adhesive and an adhesive tape including the cured product.

A curable perfluoropolyether adhesive composition including: (A) a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by C.sub.aF.sub.2aO in a main chain, wherein a represents an integer of 1 to 6: 100 parts by mass; (B) a fluorine-containing organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule: an effective curing amount; and (C) a hydrosilylation-reaction catalyst: a catalytic amount. The curable perfluoropolyether adhesive composition does not contain any organic solvent in the composition. This provides a curable perfluoropolyether adhesive composition that produces a cured product with excellent heat resistance, weather resistance, water repellency, oil repellency, chemical resistance, solvent resistance, etc., and particularly free of voids that may otherwise occur on the coating film surface during heating processes, as well as an adhesive and an adhesive tape including the cured product.