[Summary] The present invention relates to a protective film and a polarizing plate comprising the same, and provides a protective film capable of minimizing the amount of static electricity that can be generated upon peeling the protective film.

An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modifier, etc.

##STR00001##

(In the formula, the R.sup.1 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.2 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.3 moieties each independently represent a hydrogen atom or a methyl group; A.sup.1 represents a single bond, O, S, NH, or a divalent linking group containing a heteroatom; A.sup.2 represents a single bond or an (un)substituted C.sub.1-20 divalent hydrocarbon group optionally containing a heteroatom; a and c are each independently a number greater than 0; b, d, e, and f are each independently a number of 0 or greater; and m is an integer of 1 to 3. The repeating units may have been linked in any order.)

An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modifier, etc.

##STR00001##

(In the formula, the R.sup.1 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.2 moieties each independently represent an (un)substituted C.sub.1-10 alkyl group, etc.; the R.sup.3 moieties each independently represent a hydrogen atom or a methyl group; A.sup.1 represents a single bond, O, S, NH, or a divalent linking group containing a heteroatom; A.sup.2 represents a single bond or an (un)substituted C.sub.1-20 divalent hydrocarbon group optionally containing a heteroatom; a and c are each independently a number greater than 0; b, d, e, and f are each independently a number of 0 or greater; and m is an integer of 1 to 3. The repeating units may have been linked in any order.)

A curable composition includes an organic polymer (A) containing a reactive silicon group, and a cyclic N-hydroamide compound (B) having a cyclic structure. The cyclic structure of the cyclic N-hydroamide compound (B) has 6 or less ring-constituting atoms and a carboxamide bond.

A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.

A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.

A transparent curable composition includes 100 parts by weight of a polyoxyalkylene-based polymer (A); and 0.1 to 20 parts by weight of a weathering stabilizer (B). The polyoxyalkylene-based polymer (A) has a reactive silicon group that can be crosslinked by forming a siloxane bond, and the weathering stabilizer (B) is a hindered-amine-based photostabilizer (B1).

A transparent curable composition includes 100 parts by weight of a polyoxyalkylene-based polymer (A); and 0.1 to 20 parts by weight of a weathering stabilizer (B). The polyoxyalkylene-based polymer (A) has a reactive silicon group that can be crosslinked by forming a siloxane bond, and the weathering stabilizer (B) is a hindered-amine-based photostabilizer (B1).

Disclosed is an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. Also provided is an emulsion type silicone pressure sensitive adhesive composition, comprising: (A) 100 parts by weight of a silicone pressure sensitive adhesive; (B) 1-30 parts by weight of an emulsifier selected from the group consisting of a polyvinylalcohol and a polyether modified MQ resin wherein M is R 3SiO 1/2, and Q is SiO 4/2, wherein R represents C 1-20 alkyl; (C) water; and (D) catalyst.

Disclosed is an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. Also provided is an emulsion type silicone pressure sensitive adhesive composition, comprising: (A) 100 parts by weight of a silicone pressure sensitive adhesive; (B) 1-30 parts by weight of an emulsifier selected from the group consisting of a polyvinylalcohol and a polyether modified MQ resin wherein M is R 3SiO 1/2, and Q is SiO 4/2, wherein R represents C 1-20 alkyl; (C) water; and (D) catalyst.