Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.

A curable resin composition, comprising a compound represented by the following general formula (1): ##STR00001##
wherein X is a functional group comprising a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.

A curable resin composition, comprising a compound represented by the following general formula (1): ##STR00001##
wherein X is a functional group comprising a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.

A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: ##STR00001##

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: ##STR00001##

The present invention is an adhesive composition that is characterized by including (A) a polymer comprising a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth carboxylate, and (D) a tertiary amine having a pKa of 6 or more. The polymer (A) may include further a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain.

The present invention is an adhesive composition that is characterized by including (A) a polymer comprising a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth carboxylate, and (D) a tertiary amine having a pKa of 6 or more. The polymer (A) may include further a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain.