A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

Moisture-curing adhesives simultaneously having high tensile strength and elongation are prepared by admixing a silane-terminated polyurethane or polyether polymer having a defined and limited molecular weight, finely divided silica, and an organosilicon compound containing basic nitrogen.

Moisture-curing adhesives simultaneously having high tensile strength and elongation are prepared by admixing a silane-terminated polyurethane or polyether polymer having a defined and limited molecular weight, finely divided silica, and an organosilicon compound containing basic nitrogen.

A composition containing an alkoxysilyl-functional polymer, a phenylsilicone resin, and a non-reactive plasticizer, when cured, exhibits very high elongation without loss of tensile strength. The compositions are particularly well suited for flexible adhesives.

A composition containing an alkoxysilyl-functional polymer, a phenylsilicone resin, and a non-reactive plasticizer, when cured, exhibits very high elongation without loss of tensile strength. The compositions are particularly well suited for flexible adhesives.

The present invention relates to a compound having the formula L.sub.aM(OR.sup.1).sub.bR.sup.2.sub.cX.sub.d wherein M is a metal selected from Ti, Zr and Hf; L is a ligand selected from permethylpentalene, (hydro)permethyl-pentalene, (hydro)pentalene, cyclopentadiene, indene and ethylene- or silane-bridged indene, preferably (bis)indene; R.sup.1 is a 1-6C alkyl, substituted or unsubstituted phenyl, or a substituted or unsubstituted phenylalkylene group; R.sup.2 is Me or Et; X is halogen; a=1 to 3, b=1 to 3, c=0 or 1 and d=0, 1, 2 or 3; and dimers thereof, the use of the compound as an initiator in the polymerization of lactide monomer and a process for producing a polylactide performed by contacting a lactide monomer with the compound.

The present invention relates to a compound having the formula L.sub.aM(OR.sup.1).sub.bR.sup.2.sub.cX.sub.d wherein M is a metal selected from Ti, Zr and Hf; L is a ligand selected from permethylpentalene, (hydro)permethyl-pentalene, (hydro)pentalene, cyclopentadiene, indene and ethylene- or silane-bridged indene, preferably (bis)indene; R.sup.1 is a 1-6C alkyl, substituted or unsubstituted phenyl, or a substituted or unsubstituted phenylalkylene group; R.sup.2 is Me or Et; X is halogen; a=1 to 3, b=1 to 3, c=0 or 1 and d=0, 1, 2 or 3; and dimers thereof, the use of the compound as an initiator in the polymerization of lactide monomer and a process for producing a polylactide performed by contacting a lactide monomer with the compound.

The present invention relates to a compound having the formula L.sub.aM(OR.sup.1).sub.bR.sup.2.sub.cX.sub.d wherein M is a metal selected from Ti, Zr and Hf; L is a ligand selected from permethylpentalene, (hydro)permethyl-pentalene, (hydro)pentalene, cyclopentadiene, indene and ethylene- or silane-bridged indene, preferably (bis)indene; R.sup.1 is a 1-6C alkyl, substituted or unsubstituted phenyl, or a substituted or unsubstituted phenylalkylene group; R.sup.2 is Me or Et; X is halogen; a=1 to 3, b=1 to 3, c=0 or 1 and d=0, 1, 2 or 3; and dimers thereof, the use of the compound as an initiator in the polymerization of lactide monomer and a process for producing a polylactide performed by contacting a lactide monomer with the compound.