The present invention relates to a peel detection label that is a laminate having a backing, a pattern layer formed on a part of a surface of the backing, and a pressure sensitive adhesive laminate in this order, the pressure sensitive adhesive laminate having at least an intermediate layer and a pressure sensitive adhesive layer, wherein a tensile modulus Et at 23° C. of the backing is 50 MPa or greater and 1000 MPa or less.

A method of separating a support substrate and a wafer adhered to the support substrate includes inserting a trigger member into a space between the support substrate and the wafer. The space opens on a gap region of the support substrate. The gap region is within an outer periphery of a base member of the support substrate. The base member has an adhesive layer contacting the wafer. The adhesive layer does not extend to an edge of the base member facing the gap region at the space. The wafer and the base member are contacted by the trigger member which promotes separation of the wafer and the support substrate from each other.

A multilayer tape is provided. A method of masking a surface is also provided. The multilayer tape includes an inner layer, at least one middle layer, and an outer carrier layer. The inner layer has a pair of parallel adhesive strips demarking an inner gap having a predetermined width. The middle layer is adhered to the inner layer and has a pair of parallel adhesive strips demarking a middle gap narrower than the inner gap. The outer carrier layer is adhered to the middle layer. The method includes applying a multilayer tape system to a surface and removing the outer carrier layer to expose a preselected gap width. The multilayer tape system includes an inner layer, at least one middle layer, and an outer carrier layer.

The invention lies in the technical field of the textile industry and relates to a textile carrier material for adhesive tapes having a formed tear-off edge, which can be used in the automotive industry for wrapping cable sets, elongate material and lines. The problem addressed by the invention is to provide a textile carrier material for adhesive tapes having improved longitudinal strength while having improved manual tearability and stitch run stop. The problem is solved by a textile carrier material which has at least one areal region with longitudinal strength and a transverse tear-off region in the form of a tear-off edge, wherein the areal region with longitudinal strength has longitudinal stitches, produced by means of pillar stitching, of one or more consolidation threads, and wherein the transverse tear-off region has been formed at least by one or more consolidation threads formed with at least one lateral offset stitch, which are arranged at an angle of 1° to 90° to the consolidation threads arranged in a longitudinally oriented manner.

This invention provides a readily adhesive polyester film that has fewer flaws and in which no appearance defects occur due to tight winding during the storage of rolled products, and a method for efficiently producing the readily adhesive polyester film. More specifically, this invention provides a readily adhesive polyester film comprising a polyester film as a base film and a readily adhesive layer on at least one side of the base film, wherein the base film contains particles with an average particle diameter of 0.1-2 μm or more in an amount of 1 mass % or less based on the mass of the base film, and the readily adhesive layer is a cured product of a composition comprising a copolymerized polyester resin (A), a blocked isocyanate group-containing urethane resin (B), and a silicone surfactant (C). This invention also provides a method for producing a readily adhesive polyester film.

A water barrier laminate including inorganic barrier and water-trapping layers alternately arranged in order from the side facing the device to the outer side: a first inorganic barrier layer, a first water-trapping layer, a second inorganic barrier layer, a second water-trapping layer and a third inorganic barrier layer. A water-permeable underlying plastic layer is provided on one side of these inorganic barrier layers; a distance L1a between the first water-trapping layer and the first inorganic barrier layer and a distance L2a between the second water-trapping layer and the second barrier satisfy formulas (1) and (2):

L1a<3 μm  (1)

L2a<3 μm  (2)

and a distance L1b between the second inorganic barrier layer and the first water-trapping layer satisfies formula (3):

L1b≤3 μm  (3)

by interposing a water-permeable organic layer therebetween.

Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.

Proposed is a method of manufacturing a fabric wallpaper, while a bonding force of an adhesive agent attached to one side of fabric wallpaper is enhanced, and flame retarding is given to a wrap and a weft for weaving fabric at the same time. Accordingly, safety is guaranteed against the fire without additional anti-flaming treatment. Also when constructing the fabric wallpaper, general unskilled consumers may easily and conveniently perform construction. Fabric is woven by a warp and a weft of synthetic fibrous yarn in which a flame retardant resin layer is formed on the outer surface of the core. One side of the fabric is heated and pressed to form a smooth surface in which part of the resin layer is melted and extended. An adhesive agent is attached to the smooth surface, and release paper is attached to the outer surface of the adhesive agent.