In one embodiment, an adhesive material includes a backing material including a first edge and a second edge positioned opposite of the first edge. An adhesive is applied to a first side of the backing material. The first side of the backing material includes an adhesive-free region positioned between the first edge and the second edge and the backing material is structured to facilitate separation of the backing material along a predetermined path in the adhesive-free region. In one aspect, the predetermined path is formed by a number of predefined features such as perforations or indentations, although other variables are possible.

A method of separating a support substrate and a wafer adhered to the support substrate includes inserting a trigger member into a space between the support substrate and the wafer. The space opens on a gap region of the support substrate. The gap region is within an outer periphery of a base member of the support substrate. The base member has an adhesive layer contacting the wafer. The adhesive layer does not extend to an edge of the base member facing the gap region at the space. The wafer and the base member are contacted by the trigger member which promotes separation of the wafer and the support substrate from each other.

This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.

According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.

An adherent device capable of holding and releasing an object with a simple structure, and a transfer technique using the same are provided. An adherent device has a support member with at least one aperture, and a polymer material layer provided on a first principal surface side of the support member, in which an adhesive strength on a second principal surface of the support member on a side opposite the first principal surface changes by applying an external force.

Provided is an adhesive provided by patterning a metal plate with a predetermined elastic modulus, wherein the adhesive is compressively deformed in response to an operation of an adherend to be folded, so that the adhesive can easily return to an original state thereof through formation of a plurality of inner neutral planes upon deformation.

Even if a print board includes through holes that are hardly filled with material previously, the through holes can be filled with filling material appropriately. The sealing film is attached to a lower surface of the print board and the filling material is supplied from the upper surface side of the print board under a vacuum atmosphere with screen printing to fill the through holes with the filling material. Then, the film is separated from the print board and the print board is disposed on the jig plate including recesses such that the through holes correspond to the recess. Thereafter, an auxiliary filling process in which the filling material is supplied again such that the filling material protrudes from the lower surface side of the through hole is performed.

Provided are a thin electromagnetic shielding sheet and an electronic device having the same. The thin electromagnetic shielding sheet includes: a pressure-sensitive adhesive tape including a fiber-accumulating type substrate, formed by accumulation of a plurality of fibers and having a plurality of pores, and a metal coating layer on an outer circumferential surface of each of the plurality of fibers, and electrically conductive adhesive layers formed on both surfaces of the fiber-accumulating type substrate, and made of an electrically conductive adhesive material filled in the plurality of pores and electrically connected by an applied pressure; a metal layer which is adhered to the electrically conductive adhesive layer on one surface of the pressure-sensitive adhesive tape to shield electromagnetic waves; and an insulating layer formed on the metal layer.

A polymeric tape comprises a facestock extending lengthwise, the facestock including a polymer. An adhesive layer is on a first surface of the facestock. Tear-cuts are formed into at least one longitudinal edge of the facestock and extending inwardly, the tear-cuts being provided all along the at least one longitudinal edge of the facestock.

A wiring module includes a wiring body including at least one conductive wiring, an pressure-sensitive adhesive part provided on the wiring body, and a peeling part, provided on the wiring body, to which the pressure-sensitive adhesive part sticking in a manner easily peeled from the peeling part.