According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.

Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2). (1) When the cushion layer is cut out using the dumbbell from JISZ1702 and is stretched 25% at a gauge length of 40 mm and a tensile speed of 300 mm/min, the tensile stress is 2-30N/10 mm. (2) The cushion layer is formed from a thermoplastic resin that has a melt flow rate (JISK7210, 125° C./10.0 kg load) of 0.2-30 g/10 min, and a melting point of 60-110° C.

A display device includes a display panel, a digitizer disposed on the display panel, and a first coupling layer disposed between the display panel and the digitizer. The digitizer includes a base layer disposed on the display panel and have flexibility, a first circuit pattern disposed on a first surface of the base layer that faces the display panel and extended in a first direction, a second circuit pattern disposed on a second surface of the base layer and extended in a second direction crossing the first direction, and a first insulating layer disposed over the first surface of the base layer to cover the first circuit pattern and including a light-absorbing material.

An adhesive tape includes a first adhesive portion and a second adhesive portion that are arranged at an interval in a width direction thereof, and a first base and a second base. The first base includes a first surface and a second surface that are arranged opposite to each other in a thickness direction thereof. The first adhesive portion is adhered to the first surface of the first base. The second base has a first region and a second region that are distributed at an interval in the width direction of the adhesive tape. A portion of the second base located in the first region is lapped on the second surface of the first base. The second adhesive portion is adhered to a portion of the second base located in the second region, and is located at the same surface of the second base as the first base.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

A compressible seal (400A) includes a compressible body (406) having a first surface (410) and a second surface. A pattern of discontinuous adhesive regions (412) is formed of an adhesive connected with at least one of the first surface (410) or the second surface of the compressible body (406). The compressible body (406) is operable to conform around the pattern of adhesive regions (412) to prevent fluid ingress when the compressible body (406) is compressed.

A method of using a self-stick insulation. The method includes providing a piece of insulation product with an adhesive coating. The adhesive coating includes polystyrene-maleic anhydride (SMA) and/or polyacrylic acid (PAA); an alcohol amine; and at least one of a polyvinyl alcohol and a starch. The adhesive coating is then activated with liquid water. Once the adhesive coating is active, the insulation product is attached to a surface with the adhesive coating.

Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconductor wafer that has protrusions, said adhesive sheet being characterized by comprising a non-adhesive cushion layer and an adhesive layer provided on the cushion layer, with a curable resin and a support film being layered on the cushion layer side for use, wherein the viscosity of the curable resin prior to curing is 100-3000 mPa.Math.s, the Shore D hardness of the curable resin layer subsequent to curing is 5-72, and at least one of conditions (1) and (2) is satisfied. (1) When punched in the shape of a dumbbell in accordance with JIS Z1702 and stretched by 25% at a tensioning speed of 300 mm/min with a gauge length of 40 mm, the cushion layer has a tensile stress of 2-30 N/10 mm. (2) The cushion layer is composed of a thermoplastic resin that has a melting point of 60-110° C. and a melt flow rate (JIS K7210, 125° C./10.0 kg load) of 0.2-30 g/10 min.

Even if a print board includes through holes that are hardly filled with material previously, the through holes can be filled with filling material appropriately. The sealing film is attached to a lower surface of the print board and the filling material is supplied from the upper surface side of the print board under a vacuum atmosphere with screen printing to fill the through holes with the filling material. Then, the film is separated from the print board and the print board is disposed on the jig plate including recesses such that the through holes correspond to the recess. Thereafter, an auxiliary filling process in which the filling material is supplied again such that the filling material protrudes from the lower surface side of the through hole is performed.

A sheath for an elongated object is made by first combining an adhesive tape comprised of a substrate strip and a first adhesive coating at least partially covering the substrate strip with an adhesive-free band to form a laminate. Then the substrate strip and the band are overlapped at least largely such that, at the overlap, the first adhesive coating is between the substrate strip and the band. Finally the first adhesive coating is formed at the overlap between the substrate strip and the band of a plurality of spaced adhesive substrips.