A laminated film includes, in the following order, a predetermined layer, an adhesive layer containing an adhesive component and polyvalent metal particles or polyvalent metal compound particles mixed with the adhesive component, and a sealant layer laminated, in which a ratio of a maximum diameter of aggregates formed of the polyvalent metal particles or the polyvalent metal compound particles to a minimum diameter of the aggregates is 14.0 times or less.

Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

The invention relates to a two-component adhesive based on hybrid urethane-acrylate epoxies comprising a core/shell rubber demonstrating good T-peel strength. The adhesives are suitable for use in industry, e.g., as adhesives for transportation industry applications.

Unified multilayer articles comprising alternating layers including: a) at least two elastomeric foam interior layers, which are interior layers of the unified multilayer article, and which comprise: i) a first elastomeric material, and distributed therein: ii) expanded polymeric microspheres; where the elastomeric foam interior layers alternate with: b) at least two alternate layers directly bound to adjacent elastomeric foam interior layers; and wherein at least one of the alternate layers is an interior layer of the unified multilayer article. Adhesive films comprising the unified multilayer articles of the present disclosure are also provided, which additionally comprises at least one pressure sensitive adhesive attachment layer, which is an outermost PSA layer directly bound to a first face of the unified multilayer article and available for attachment of the adhesive film to an adherend.

Disclosed are a double-sided adhesive film for bonding heterogeneous substrates, a laminated film, and a display device. The double-sided adhesive film for bonding heterogeneous substrates comprises: a first adhesive layer; and second adhesive layer which is disposed on the first adhesive layer and has a different adhesive force from that of the first adhesive layer to the same substrate.

A pressure-sensitive adhesive composition includes a pressure-sensitive adhesive component and a gas generating particle dispersed in the pressure-sensitive adhesive component. A tensile elastic modulus at 25° C. of the pressure-sensitive adhesive composition is 5 MPa or less. A gas generation amount at which the gas generating particle is generated in the pressure-sensitive adhesive composition is 5 mL/g or more in terms of decane at 0° C. and 1013 hPa in a solid content of the pressure-sensitive adhesive composition.

The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

A sealant structure and a method of fabricating a display panel are provided. The sealant structure comprising a first adhesive layer and a second adhesive layer, wherein the first adhesive layer comprises a plurality of first adhesive strips, the first adhesive strips are adjacent to each other end to end, and a first gap is disposed between any two adjacent first adhesive strips; wherein the second adhesive layer comprises a plurality of second adhesive strips, the second adhesive strips are adjacent to each other end to end, and a second gap is disposed between any two adjacent second adhesive strips; wherein projections of first gaps on a display body do not overlap with projections of second gaps on a display body.