An object of the present invention is to provide an adhesive film that can be applied easily to an adherend having a three-dimensional shape. An adhesive film according to the present disclosure is an adhesive film having a three-dimensional molded shape and including: a base layer; an adhesive layer including a fine structure in a surface; and a liner layer covering the adhesive layer. The fine structure of the adhesive layer includes a plurality of convex parts. Each of the plurality of convex parts includes two or more parts joined to each other via an interface. A first part present in a top of the convex part includes a non-adhesive or weak adhesive material, and a second part present below the first part includes a strong adhesive material.

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.

A pressure-sensitive adhesive tape (10) has a base material (11), and a pressure-sensitive adhesive layer (20) provided on the surface (11A) of the base material (11) and containing cells (21) in the inside thereof, wherein the cells (21) include first cells (21A) contacting with the surface (11A) of the base material (11) and second cells (21B) disposed at positions away from the surface (11A) of the base material (11). Thereby, even when the cells (21) are made to be much contained in the pressure-sensitive adhesive layer (20) and the amount of a pressure-sensitive adhesive is made small, a high pressure-sensitive adhesive performance of the pressure-sensitive adhesive tape (10) is retained.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

An adhesive article adapted for removable adhesive bonding between any shaped surfaces of the objects, includes stretch release mesh layers. The non-adhesive mesh layers are sequential release type strips with affixed lobes attached on sides and front back portion of the mesh strips which are stretched for progressive release of the surfaces of the adhesive strip from the surfaces of the objects and provide separation between each other. Another central mesh, provides a sequential release from the major surfaces between adhesive strips. This sequential release reduces the incidence of unwanted damage to surface and also able to hold heavy weight with that adhesive article. To prevent unwanted damage during movement between the surface of objects and adhesive strips and between the major surfaces of adhesive strips in the removal process and therefore provides successful sequential release of the surfaces of the objects.

The present disclosure is directed to a multilayer pressure sensitive adhesive (PSA) assembly, comprising at least one pressure sensitive adhesive layer and a polymeric foam layer, wherein the pressure sensitive adhesive layer comprises a pressure-sensitive adhesive composition comprising a reaction product of a polymerizable material comprising: a) 2-propylheptyl acrylate as a first monomer; and optionally b) a second monomer having an ethylenically unsaturated group. The present disclosure is also directed to a method of manufacturing such a multilayer PSA assembly.

The application provides a product with a protective coating and a manufacturing method thereof. Prepare a first precursor dispersion comprising a first active organic precursor, and the first active organic precursor is a fluorine-free monomer. Prepare a second precursor dispersion comprising a second active organic precursor, and the second active organic precursor is a fluorine-containing monomer. Apply the first precursor dispersion to a product body, and dry the applied first precursor dispersion to form a first dried layer. Apply the second precursor dispersion to the first dried layer to cover the first dried layer, and dry the applied second precursor dispersion to form a second dried layer, so that the first active organic precursor and the second active organic precursor are polymerized to obtain a product with a protective coating.

Adhesive articles with multi-layer adhesive constructions include a substrate and a multi-layered adhesive. The multi-layered adhesive includes a layer of a first adhesive in contact with the surface of the substrate, and a layer of siloxane-based pressure sensitive adhesive in contact with the first adhesive. The siloxane-based pressure sensitive adhesive includes a siloxane-(meth)acrylate co-polymer. The thickness of the siloxane-based pressure sensitive adhesive layer is less than the thickness of the first adhesive layer.