Patent classifications
C09J2301/208
Method for preparing composites on basis of graphene bonding
The invention utilizes swelling and fusion effects of graphene oxide in a solvent to implement cross-linked bonding of a graphene material itself and materials such as polymers, metal, paper, glass, carbon materials, and ceramics. The present invention not only overcomes the shortcoming in traditional adhesives of residual formaldehyde, but also has short drying time, high bonding strength and high corrosion resistance. The present invention is widely applied in the fields of aviation, aerospace, automobiles, machinery, construction, chemical, light industry, electronics, electrical appliances, and daily life, etc.
MULTI-PHASE ADHESIVE ARTICLES AND METHODS THEREOF
Provided are adhesive articles and related methods of making and use. The adhesive article includes one or more patterned adhesive layers comprising compositionally and spatially distinct adhesives that are laterally disposed relative to each other. The first and second adhesives are optionally capable of being functionally cured to provide a structural adhesive bond with a substrate. These adhesives can provide high fracture toughness and high modulus characteristics not otherwise possible in a homogeneous adhesive composition. These adhesives can provide some degree of crack arrestment and significantly reduce the need for mechanical fasteners in industrial bonding applications.
Foldable display screen and assembling method thereof, and display apparatus
A foldable display screen and an assembling method thereof, and a display apparatus are provided. The foldable display screen includes: a display panel; a touch sensing panel, located on a side of the display panel; a first optical adhesive layer, located on a side of the touch sensing panel away from the display panel; and a second optical adhesive layer, located between the display panel and the touch sensing panel; a thickness of the first optical adhesive layer and a thickness of the second optical adhesive layer are both 20 μm to 200 μm; and at a working temperature, an elastic modulus of the first optical adhesive layer and an elastic modulus of the second optical adhesive layer are both less than 1 Mpa.
ELONGATED ELASTIC SEAM TAPE WITH ELECTRICAL CONDUCTOR
The present invention relates to an elongated elastic seam tape comprising an elongated elastic conductor as well as to a method of manufacturing such an elongated elastic seam tape.
Polymeric films and display devices containing such films
Polymeric films, which may be adhesive films, and display devices including such polymeric films, wherein a polymeric film includes: a first polymeric layer having two major surfaces, wherein the first polymeric layer includes a first polymeric matrix and particles. The first polymeric layer includes: a first a polyolefin-based low WVTR adhesive polymeric matrix having a refractive index n.sub.1; and particles having a refractive index n.sub.2 uniformly dispersed within the first polymeric matrix; wherein the particles are present in an amount of less than 30 vol-%, based on the volume of the first polymeric layer, and have a particle size range of 400 nanometers (nm) to 3000 nm; and wherein n.sub.1 is different than n.sub.2.
Web with adhesive layer having partially embedded filaments
An adhesive-backed film with an adhesive layer having thermoplastic or thermoset filaments partially projecting therefrom, to promote fluid egress and repositionability.
Protective film
A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.
TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR MANUFACTURING LAMINATE
A temporary adhesive material for substrate processing adhesion to support the substrate opposite to a surface, the material including: a first temporary adhesive layer; and a second temporary adhesive layer distinct from the first layer, where at least one of the first layer and the second layer has a minimum viscosity of 1 Pa.Math.s or higher and 10,000 Pa.Math.s or lower within 130° C. to 250° C., where: the temporary adhesive material contains 10 parts by mass or more and 100 parts by mass or less of a siloxane bond-containing polymer having a weight-average of 3,000 or more and 700,000 or less as measured by GPC based on a total mass of 100 parts. A temporary material for substrate processing that facilitates the adhesion and separation, allows a quick layer formation, has dimensional resistance to thermal processes, and can raise the productivity of substrates; and manufacturing a laminate using the same.
ADHESIVE FILM
The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.
ADHESIVE SHEET
Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):
Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116 (1).
In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.