The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

The present application provides a pressure-sensitive adhesive layer comprising at least first and second regions having different physical properties, wherein the difference in physical properties, such as an elastic modulus or creep strain rate is maintained relatively large for each region, and the difference in physical properties, such as a peel force or recovery rate is maintained relatively small for each region.

The present invention is intended to provide a gel sheet having a formulation providing an adhesive force on the skin side suitable for the skin (i.e., a gel having a low adhesive force and being able to withstand a tip pressure of a terminal and the like), and concurrently having a sufficient adhesive force against an electrode element on the side opposite to the skin side. The present invention is a gel sheet having a laminated structure of a layer A and a layer B, characterized in that the storage elastic modulus of the layer A at 23° C. and 10 Hz is 12,000 to 40,000 Pa, and the storage elastic modulus of the layer B at 23° C. and 10 Hz is 2,000 to 10,000 Pa.

An optically clear adhesive film includes at least one first adhesive layer and at least one second adhesive layer that are stacked. A modulus of each first adhesive layer is less than a modulus of each second adhesive layer, and a glass transition temperature of the first adhesive layer is less than a glass transition temperature of the second adhesive layer.

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

Transaction and proximity cards having an improved construction and systems for utilizing such cards. The card system includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply. In one card embodiment, the card further includes at least one inlay between the only one top ply and the only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply and the at least one inlay. In addition, the transaction card system includes card dispensers adapted to dispense the cards.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa) (b) in contact with the substrate (Sa), a layer (Lb) of a pressure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20° C. or lower, and (c) in contact with the layer (Lb), a layer (Lc) that comprises, (i) one or more acrylic polymer (POLc1) having Tg of 20° C. or lower, and (ii) one or more acrylic tackifier polymer having Tg of −10° C. or higher. Also provided are a method of making the pressure sensitive adhesive article and a bonded article made by using the pressure sensitive adhesive article.

The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including at least one adhesive layer, the adhesive layer containing a base polymer, a tackifier resin (T1) having a hydroxy value of less than 20 mgKOH/g, and a tackifier resin (T2) having a hydroxy value of 20 mgKOH/g or more and 120 mgKOH/g or less, the base polymer being a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and the adhesive layer containing the tackifier resin (T1) in an amount of 10 parts by weight or more and 60 parts by weight or less relative to 100 parts by weight of the base polymer, and the tackifier resin (T2) in an amount of 1 part by weight or more and 40 parts by weight or less relative to 100 parts by weight of the base polymer.