An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.

The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.

The present invention provides solvent-based compostable cold seal release lacquers for use in packaging structures. The lacquers of the invention comprise resins, such as polyamide resins, comprising greater than 90% biobased carbon, generally prepared from renewable sources, e.g., plants such as rice. The present invention also provides the use of the inventive compostable lacquers as cold seal release lacquers in cold seal packaging, along with eco-friendly packaging film, etc., and has the potential to make the cold seal packaging fully compostable.

A multi-use adhesive tape including a first backing layer, a first adhesive layer on at least part of a surface of the first backing layer, a second backing layer and a second adhesive layer on at least part of a surface of the second backing layer. The second adhesive layer is releasably engaged with the first backing layer and the tape is configured so that the tape can be applied to an article using the first adhesive layer and, after removal from the article, the first backing layer can be removed so that the second backing layer can be applied to the article using the second adhesive layer.

An object of the present invention is to provide a pressure-sensitive adhesive sheet for a touch panel which is excellent for the operability of a capacitance-type touch panel, which is able to suppress the occurrence of malfunctions in a capacitance-type touch panel in a wide range of temperature environments from low temperatures to high temperatures, and which is also excellent in pressure-sensitive adhesion. In addition, another object of the present invention is to provide a laminate for a touch panel and a capacitance-type touch panel which include a pressure-sensitive adhesive sheet for a touch panel. In the pressure-sensitive adhesive sheet for a touch panel of the present invention, a relative dielectric constant obtained by impedance measurement at 1 MHz at 20° C. is 4.0 or more, a temperature dependency obtained from a temperature dependency evaluation test is 25% or less, and a 180 degree peel strength with respect to glass is 0.2 to 1.2 N/mm.

The present disclosure relates to a multilayer protective film that may include a multilayer component and a release liner component underlying the multilayer component. The multilayer component may have a first PET layer overlying a second PET layer. The multilayer protective film may further have a thickness ratio MPF.sub.T:RL.sub.T of not greater than about 14:1, where MPF.sub.T is equal to the thickness of the multilayer component and RL.sub.T is equal to the thickness of the release liner component.

A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.

A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.