The double-sided tape for fixing an electrode constituent body is used in an electrochemical device that houses in a pouch-type outer casing an electrode constituent body wherein a positive electrode member, a separator member and a negative electrode member are layered or wound. The double-sided tape comprises a surface having a pressure-sensitive adhesive for adhering to the electrode constituent body, and a surface having a heat-sensitive adhesive for adhering to the pouch-type outer casing.

Systems and methods are described for manufacturing an adhesive tape. An example method includes: providing a plurality of adhesive webs, wherein each web includes a hot melt adhesive adhered to a backing material; providing a fabric web having a fabric material; guiding a first adhesive web from the plurality of adhesive webs into a first position proximate a first side of the fabric web; guiding a second adhesive web from the plurality of adhesive webs into a second position proximate a second side of the fabric web; applying heat and pressure to form a web of the baffle tape in which the first adhesive web is bonded to the first side of the fabric web and the second adhesive web is bonded to the second side of the fabric web; and rewinding the web of the baffle tape into a roll.

The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.

The present invention relates to an adhesive composition for optical use, which is applied to optical devices or display devices and thus may exhibit excellent adhesion performance while exhibiting a high barrier performance based on a low water vapor transmission rate, and may implement both excellent optical characteristics and durability, and specifically, provides an adhesive composition for optical use, the adhesive composition including: a thermally curable rubber including an isobutylene-isoprene rubber having a carboxyl group and an isobutylene-isoprene rubber having a hydroxy group; and a thermal crosslinking agent. Further, the present invention provides an adhesive film for optical use, including an adhesive layer including photocured products of the adhesive composition for optical use.

Provided is a novel double-sided pressure-sensitive adhesive tape that has excellent impact resistance and preferably further has excellent oil resistance. The double-sided pressure-sensitive adhesive tape has a local maximum value of a loss tangent tan δ of 1.5 or more, and a temperature at which the local maximum value is obtained, of from −30° C. to 0° C.

Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

A hot melt adhesive film, and a preparation method, use, and an organosilicon polymer thereof are provided. The hot melt adhesive film includes: an inner layer, which is a polyolefin elastomer (POE); outer layers, which are an ethylene-vinyl acetate (EVA) copolymer on two surfaces of the inner layer; and intermediate layers, which are an organosilicon polymer between the inner layer and the outer layers. As intermediate layers, the organosilicon polymer plays the role of connection and transition, improves a bonding force between EVA and POE layers, and improves the stability of the hot melt adhesive film during long-term use. The hot melt adhesive film can be used as a packaging material for solar panels, touch screens, and the like.

To provide a baseless double-sided adhesive sheet or tape that is configured such that adhesive does not exude during storage, or moreover during slitting to a predetermined size, or the like, and that is also capable for exhibiting the desired performance of having a cohesive force that resists peeling, without sacrificing the initial adhesive strength, and to provide a method for manufacturing the same.

In the baseless double-sided adhesive sheet or tape, an adhesive layer formed from an adhesive serves as a center layer, and adhesive layers and formed from an adhesive are layered onto a front face and a rear face of the adhesive layer serving as the center layer. Fibers are least dispersed in the adhesive layer serving as the center layer, and the adhesive layer serving as the center layer between the adjacent adhesive layers has a relatively high fiber density and relatively low flowability.

Examples of computing devices including a processor, memory, and a display device housed within the same enclosure are described. In examples, the display device, which may include a cover glass, may be attached to the enclosure using a multilayer adhesive member, the multilayer adhesive including a first adhesive layer and a second adhesive layer disposed on opposite sides of a foam layer. The first and/or second adhesive layers may include two or more layers of a pressure sensitive adhesive (PSA), which may be separated using one or more adhesive carrier films. In examples, the first and/or second adhesive layers may include a low tack (e.g. removable) PSA for adhering to surfaces of the display and enclosure and for facilitation removal and re-workability of the adhesive joint.