Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.

Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.

The present disclosure relates to a light bar adhesive tape for a backlight source, including: a transparent bonding material layer configured to be bonded to a surface of a light bar flexible circuit board; a black and white flexible coating layer having a black surface on one side and a white surface on the other side, the white surface of the black and white flexible coating layer being bonded with the transparent bonding material layer; and a black and white bonding material layer having a black surface on one side and a white surface on the other side, the black surface of the black and white bonding material layer being bonded with the black surface of the black and white flexible coating layer. The present disclosure also relates to a backlight module including the light bar adhesive tape as above described and a display device including the backlight module.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa) (b) in contact with the substrate (Sa), a layer (Lb) of a pressure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20° C. or lower, and (c) in contact with the layer (Lb), a layer (Lc) that comprises, (i) one or more acrylic polymer (POLc) having Tg of 20° C. or lower, and (ii) one or more olefin copolymer. Also provided are a method of making the pressure sensitive adhesive article and a bonded article made by using the pressure sensitive adhesive article.

A method allows for rapid manufacture of relatively thick adhesive coatings using a continuous process, where a single thin coating is continuously converted into a single thicker adhesive laminate. An exemplary process includes the steps of: (1) producing a web having a first surface with an adhesive layer and a second surface with a release liner; (2) slitting the web longitudinally into a first section and a second section; (3) laminating a backing film to the adhesive layer of the first section; (4) removing the release liner of the laminate of step (3) exposing the adhesive layer of the first section; and (5) laminating the second section to the laminate of step (4), wherein the adhesive layer of the laminate of step (4) is combined with the adhesive layer of the second section.

A tape structure, a display panel and a display device utilizing the tape structure is provided. The tape structure includes a first adhesive layer, a supporting layer, and a second adhesive layer. The first adhesive layer extends along a first direction and has a first surface. The supporting layer is disposed on the first surface and includes a plurality of supporting units. A part of the second adhesive layer is attached to the first surface. The supporting layer is covered by the first adhesive layer and the second adhesive layer located at the side of the supporting layer opposite to the first surface.

An anisotropic conductive film with a structure wherein an electrically insulting adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.

Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use of the adhesive compositions and tapes. In addition, vibration damping assemblies utilizing the adhesives are described.