Embodiments of the present disclosure are directed to a coating composition comprising a first thermoplastic resin suspended in a liquid medium, and a second thermoplastic resin in the form of solid particles, wherein the second thermoplastic resin is incorporated but insoluble in the liquid medium.

A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.

A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×10.sup.5 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

Method comprising the following steps: i) manufacturing components on a face of a substrate fastened to a first temporary substrate, ii) fastening a second temporary substrate onto the substrate, iii) removing the first temporary substrate, iv) manufacturing components on another face of the substrate, the first and second temporary substrates having surface areas greater than the surface area of the substrate of interest, during step ii), an adhesive film is disposed between the substrate and the first temporary substrate or between the substrate and the second temporary substrate, the adhesive film forming a lateral band around the substrate and adhering to the temporary substrates, the adhesion energy E.sub.1 between the substrate of interest and the first temporary substrate being greater than the adhesion energy E.sub.2 between the substrate of interest and the second temporary substrate, the adhesion energy E.sub.31 between the first temporary substrate and the adhesive film being lower than the adhesion energy E.sub.32 between the second temporary substrate and the adhesive film.

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

An hotmelt adhesive for absorbent article (20), wherein the hotmelt adhesive comprises at least one low molecular weight metallocene-catalyzed polyolefin, at least one high molecular weight polyolefin having a peak molecular weight of from 130,000 g/mol to 700,000 g/mol and at least one tackifier. The hotmelt adhesive comprises less than 10% by weight of mineral oil. The hotmelt adhesive is particularly useful to form a core wrap bond (82, 84, 86) and/or a patch-to-core bond (78).

In some embodiments, a printed laminate comprises a first substrate having a first side and a second side, an ink layer at least partially adhered through direct printing to the first side of the first substrate, and a second substrate comprising a heat activatable adhesive and having a first side and a second side. The first side of the second substrate may be at least partially laminated to the second side of the first substrate.

A multilayer structure for transporting hydrogen, including, from the inside, a sealing layer and at least one composite reinforcement layer, an innermost composite reinforcement layer being wound around the sealing layer, the sealing layer being a composition predominantly of: a polyamide thermoplastic polymer PA11, up to less than 15% by weight of impact modifier, up to 1.5% by weight of plasticizer relative to the total weight of the composition, the composition being devoid of nucleating agent and of polyether block amide (PEBA), and at least one of the composite reinforcement layers being a fibrous material in the form of continuous fibers, which is impregnated with a composition predominantly of at least one polymer P2j, (j=1 to m, m being the number of reinforcement layers), the structure being devoid of an outermost layer and adjacent to the outermost layer of a composite reinforcement layer made of a polyamide polymer.