A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

Systems and methods are described for manufacturing an adhesive tape. An example method includes: providing a plurality of adhesive webs, wherein each web includes a hot melt adhesive adhered to a backing material; providing a fabric web having a fabric material; guiding a first adhesive web from the plurality of adhesive webs into a first position proximate a first side of the fabric web; guiding a second adhesive web from the plurality of adhesive webs into a second position proximate a second side of the fabric web; applying heat and pressure to form a web of the baffle tape in which the first adhesive web is bonded to the first side of the fabric web and the second adhesive web is bonded to the second side of the fabric web; and rewinding the web of the baffle tape into a roll.

The description relates to solvent free films and textiles that receive the solvent free films.

The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

Disclosed are a lamination film and a method for preparing the same. The lamination film includes a printed or coated color layer, an aluminum-coated layer, a reinforced aluminum-coated resin layer, a molded resin layer, a film layer, a base coat layer and a hot melt adhesive layer which are sequentially arranged.

Hot melt processable composition mixtures include an acid-functional (meth)acrylate-based adhesive composition and a zinc di-(meth)acrylate salt. The adhesive composition has a hot melt processing temperature, and the zinc salt has a melting point that is higher than the hot melt processing temperature of the adhesive composition. The mixture is hot melt processable, and upon application to a substrate, the mixture forms an ionically crosslinked layer with thermally reversable ionic crosslinks.

A pressure sensitive adhesive comprising the polymerization product of a polymerizable composition comprising: (a) one or more (meth)acrylate ester monomers; (b) one or more hydrophilic non-acidic monomers; and (c) reactive, ionic surfactant. Also articles comprising such adhesives and methods for making such adhesives and such articles.

Identification labels and their incorporation in rubber-based articles are described. The labels include RFID components and can be incorporated in tires. The labels can withstand the relatively harsh conditions associated with vulcanization.

The inventors have discovered that certain hot melt adhesives can be used to form a stable stacked pallet that can limit the need for additional packaging materials e.g. inter-layer and pallet wrap.

The present invention is related to adhesive compositions and their applications. In particular, the adhesive compositions described herein comprise a propylene-based polymer and an ethylene-based polymer with varying comonomer content.