The invention concerns a method for reconfiguring a musical instrument. The method includes a step of applying a sticker on at least one technical surface of the musical instrument, characterized in that this application is made without glue and in that the sticker comprises an elastomer layer configured to come into contact with the technical surface and adhere to it in a reversible manner without application of glue. The invention further concerns a sticker and an associated manufacturing method.

A microstructured pressure-sensitive surface is described comprising a Wenzel-Cassie hydrophilic-hydrophobic zone structure and capillary action with improved peel strength. The capillary action is enhanced by the Wenzel-Cassie zone creation, and the barrier energy to disruption of the Wenzel-Cassie zone is increased by the capillary action. The micro-structured surfaces of the present invention create water zones of exclusion, where entropic effects reinforce Wenzel-Cassie zone stability, creating a suction effect that conforms the microstructure surface to a target surface.

A dry adhesive for attachment to a flexible adherend comprises a shape memory polymer having a glass transition temperature (T.sub.g) above 25° C. and a compliant backing layer attached to the shape memory polymer. The shape memory polymer is configured to form a conformal and/or hermetic contact with a flexible adherend at temperatures at or above the T.sub.g and to retain the conformal and/or hermetic contact during flexing of the flexible adherend at temperatures below the T.sub.g

Disclosed is a pad structure for transferring a flat panel that includes a circular adhesive force adjustment pattern having a predetermined diameter in the center of the pad body, and a ring-shaped microciliated member having a circumferential surface surrounding the first adhesive force adjustment pattern and including a plurality of cilia spaced apart from one another, and thus provides advantages of improving the adhesive force per unit area due to the functions of the pad, without a separate vacuum device, of being easily and simply attached to and detached from the blade at a desired position thereon, and of maximizing productivity by easily and smoothly performing quality control, preventive maintenance, and inventory management of the pad for transferring a flat panel based on serial number standardization (product information standardization).

The present invention is a method for controlling flatness of a wafer including the steps of: providing a holding member having a holding surface including a plurality of segments, where each of the plurality of segments includes a dry adhesive fiber structure; making the holding surface of the holding member adhere to a wafer to make the holding member hold the wafer; obtaining information on flatness of the wafer by measuring flatness of the wafer to; and releasing adhesion of the dry adhesive fiber structures to the wafer in a part of the plurality of segments of the holding surface of the holding member based on the information on flatness. This can provide: a method for controlling flatness by which flatness of a wafer can be controlled sufficiently.

A molded body with a structured surface for reversible adhesion to surfaces includes projections having an aspect ratio of up to 10. The structure can be easily detached from the surface by a lateral movement.

An object includes at least two faces which are suitable for dry adhesion and differ in their adhesion parameters. By suitable structuring, it is possible, where appropriate in combination with a suitable contact pressure, to selectively control the detachment of surfaces contacted on these faces.

A structure with improved adhesion includes projections and a backing layer, the rigidity of the backing layer being variable, and the end faces defining a common surface.

Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.

An adhesive apparatus with an electrostatic adhesive including a microstructured adhesive disposed over an electrode and/or a piezoelectric element. The adhesive can be added to any robotic gripper, such as a gripper finger formed of a flexible material and including a grip surface. The electrode and/or a piezoelectric element can be used for applying an electrostatic field and/or ultrasonic vibration, configured for cleaning the microstructured adhesive, releasing the adhesive, and/or sensing a load on the adhesive apparatus.