The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.

A hot melt adhesive composition that includes at least 40% by weight of a metallocene-catalyzed polybutene-1 selected from the group consisting of polybutene-1 homopolymer, polybutene-1 copolymer, and combinations thereof, the metallocene-catalyzed polybutene-1 including at least 30% by weight, based on the weight of the hot melt adhesive composition, of a metallocene-catalyzed polybutene-1 having a melt flow rate of at least 1000 grams per 10 minutes at 190° C., tackifying agent, and at least 15% by weight wax, the hot melt adhesive composition having a specific gravity of less than 0.95.

The present application provides an adhesive composition for a foldable display including a thermocurable resin; and a crosslinking agent, wherein the thermocurable resin includes a unit derived from a compound including at least one N or O; and at least one unshared electron pair in the molecule, and the thermocurable resin has a glass transition temperature of −70° C. or lower, an adhesive film using the same, and a foldable display including the same.

Provided are an adhesive tape having high flex resistance that can withstand repeated bending by folding operations and the like while maintaining high impact resistance, and an electronic device including the adhesive tape. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed, in which the foam base contains an elastomer resin as a main component. The foam base has a tensile stress of 150 N/cm.sup.2 or less at 100% strain based on a stress-strain curve and a foam density of 0.2 g/cm.sup.3 to 2.0 g/cm.sup.3.

A method for producing a pressure-sensitive adhesive sheet of the present invention includes: forming a pressure-sensitive adhesive layer 10 formed of a transparent, light-cured base pressure-sensitive adhesive material on a support S1; irradiating the pressure-sensitive adhesive layer 10 with an ultraviolet ray U to cure the pressure-sensitive adhesive layer; providing a solution 12 of an ultraviolet absorbing agent 11; applying the solution 12 to one of opposite surfaces of the cured pressure-sensitive adhesive layer 10a to cause the ultraviolet absorbing agent 11 contained in the solution 12 to infiltrate from the one surface in a thickness direction of the pressure-sensitive adhesive layer 10a; and drying the pressure-sensitive adhesive layer 10a.

An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.

A continuous process for making a pressure-sensitive adhesive is disclosed. A mixture comprising natural rubber having a Mooney viscosity of 85 to 100, a tackifier, a filler, and 0.1 to 5 wt. % of an added C.sub.12-C.sub.24 fatty acid based on the amount of mixture is masticated in a first section of a single- or twin-screw extruder. Mastication of the mixture continues in at least one subsequent extruder section in the presence of additional tackifier. The product is a homogeneous, reduced-viscosity pressure-sensitive adhesive. The minor proportion of added C.sub.12-C.sub.24 fatty acid aids mastication of the rubber and enables high throughput without addition of peptizers. Duct tapes made from the adhesives display improved adhesion to steel, better adhesion bond strength, and enhanced seven-day clean removability from even difficult substrates such as marble or ceramic tile.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

Provided herein are films comprising a core layer sandwiched between an outer layer and a scaling layer. The film has a seal initiation temperature at 5 N/15 mm between about 82° C. and about 88° C., a 1% secant modulus m MD between about 300 MPa and about 400 MPa, and plateau seal strength at between about 16 and about 17 N/15 mm. While the outer layer and core layers comprise polyethylene compositions, the sealing layer comprises a polyethylene blend. The polyethylene blend comprises a plastomer and a polyethylene composition in an amount equal to or less than 50 wt %.

Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.