A computing system compares various reference fingerprints each representing a reference media stream broadcast on a different respective known channel, and the computing system determines that a plurality of the reference fingerprints match each other, thus defining a multi-match group of the matching reference fingerprints. In response, the computing system identifies a fingerprint feature that could define a distinction between the reference fingerprints, and the computing system resolves the multi-match based on the identified feature, thereby determining the channel carrying the media stream being rendered by the media presentation device. And the computing system could then take channel-specific action based on the determined channel.

A variety of adhesive laminates are described, many of which perform functions such as liquid indication, outgassing, liquid retention, electrical conducting, and sound channeling. Also described are adhesive regions on face materials in which the regions exhibit particular dimensional proportions. Methods involving direct and transfer coating of adhesives are also described. In a particular version, a method of roll to roll transfer coating of sprayed pressure sensitive adhesives is described. Also described are various adhesive films and laminates many of which can be produced using the methods.

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

The present invention relates to an adhesive sheet. As the adhesive sheet of one embodiment of the present invention retains the properties of conventional adhesive sheet, such as excellent adhesion and durability in high temperature and humidity environment, it can be utilized for manufacturing large-scale electrodes at low prices, and the electrodes manufactured above can be used for various applications such as solar cell, display, and touch panel.

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.

The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.

A biosensor, which operates by power supplied from a battery, includes an electrode portion positioned on at least a side of one terminal of the battery; and a conductive adhesive tape having conductivity provided between the one terminal and the electrode portion. A bending load per unit bending deflection of the conductive adhesive tape is 0.035 N/cm or less.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.