The present invention relates to a pressure-sensitive adhesive comprising at least one poly(meth)acrylate; and at least one acrylonitrile-butadiene rubber, wherein
the at least one acrylonitrile-butadiene rubber is present at 1 to 49 wt %, based on the total weight of the pressure-sensitive adhesive. The invention further relates to the production of a pressure-sensitive adhesive of the invention and also to the use of the pressure-sensitive adhesive of the invention for the bonding of components of electronic devices or of components in automobiles. Lastly the present invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive according to the present invention.

The invention relates to a surfactant comprising a grafted rosin ester which is a rosin ester grafted with a capped polyalkylene glycol, wherein the capped polyalkylene glycol is a polyalkylene glycol capped by an alkyl ether and an aqueous dispersion consisting of an aqueous phase and resin particles dispersed in the aqueous phase, wherein the dispersion comprises the surfactant according to the invention.

The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, wherein the light transmittance in the wavelength range of 380 to 500 nm is 25% or less and the light transmittance in the wavelength range of 800 to 2,500 nm is 60% or more.

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a polymerization control agent. At least one of the main agent and the initiator further contains a peroxide.

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a compound having a thiocarbonylthio structure.

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

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An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec-1 and measured at a temperature of 120° C., being 5.0×103 poise to 1.0×105 poise inclusive.

An adhesive composition includes a resin, a crosslinking agent, and a light absorber. The light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine compound having a ring structure.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.