C09J2301/412

Aqueous Coagulatable Polymer Dispersion and Use Thereof as an Adhesive
20170291965 · 2017-10-12 · ·

The invention relates to an aqueous coagulatable polymer dispersion comprising at least one polymer which is dispersed in an aqueous phase, thermoplastic micro-spheres which contain a propellant, and at least one additional component which is selected from the group consisting of polyols, polyamines, and thermoplastic polymers. The invention further relates to a coagulate which can be obtained by the thermal and/or mechanical and/or ultrasonically-initiated coagulation of the aqueous polymer dispersion according to the invention, to an adhesive comprising or consisting of the coagulate, to a substrate which is completely or partly coated with said coagulate, to a method for producing such a coated substrate, and to coated substrates which can be obtained using said method. The coagulate can be used as an adhesive or as a binder in 3D-printing methods.

PRESSURE SENSITIVE ADHESIVE ARTICLE
20220306909 · 2022-09-29 ·

Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa) (b) in contact with the substrate (Sa), a layer (Lb) of a pressure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20° C. or lower, and (c) in contact with the layer (Lb), a layer (Lc) that comprises, (i) one or more acrylic polymer (POLc) having Tg of 20° C. or lower, and (ii) one or more olefin copolymer. Also provided are a method of making the pressure sensitive adhesive article and a bonded article made by using the pressure sensitive adhesive article.

Protective film and display device having the same
11427737 · 2022-08-30 · ·

A display device includes a protective film that includes an adhesive layer. The adhesive layer has a first adhesive strength at a room temperature and has a second adhesive strength equal to or smaller than about 25% of the first adhesive strength in a second state in which a heat or ultraviolet ray is provided.

METHOD FOR CREATING A FOAMED MASS SYSTEM

A method for producing a foamed thermally crosslinked mass system, wherein the mass system is foamed at a first temperature in a first step, and crosslinker substances are added to the mass system in a subsequent step at a second temperature lower than the first temperature, wherein the crosslinker substances are crosslinker substances for thermal crosslinking of the mass system.

ADHESIVE COMPOSITION
20220267653 · 2022-08-25 ·

There is provided an adhesive composition having both high adhesion force and stable adhesion performance. An adhesive composition comprising, per 100 parts by mass of a curable resin (A), 1 part by mass or more and 80 parts by mass or less of substantially spherical organic particles (B), wherein the adhesive composition is used in an application amount of 5 mg/cm.sup.2 or more and 500 mg/cm.sup.2 or less on an adherend.

FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT USING THE FILM

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

PRESSURE SENSITIVE ADHESIVE FOAM

The present disclosure relates to a pressure sensitive adhesive foam comprising a rubber-based elastomeric material and at least one hydrocarbon tackifier, wherein the hydrocarbon tackifier(s) have a Volatile Organic Compound (VOC) value of less than 1000 ppm and a Volatile Fogging Compound (FOG) value of less than 1500 ppm, when measured by thermogravimetric analysis according to the weight loss test methods described in the experimental section. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive foam and uses thereof.

Process for manufacturing a bi-material shaft

A process for manufacturing a putter with a bi-material shaft is disclosed herein. The putter comprises a putter head, the bi-material shaft, a mass member and a grip. The bi-material shaft comprises a body with a tip end and a butt end. The body comprises a metal section extending from the tip end to a connection point, and a composite section extending from the butt end to the connection point. The mass member is positioned within an opening at the butt end of the shaft. Mass from the shaft is transferred to the club head and the mass member in the butt end of the shaft.

COMPOSITE SYSTEM WITH GENTLY ADHERING LINER MATERIAL
20170260424 · 2017-09-14 · ·

A double-sided adhesive tape having a heat-activatable adhesive layer protected with an interliner, in order to allow such tapes to be guided stably over cutting and winding units and also to be stably stored and transported, has a composite system comprising: an adhesive tape (A) comprising: a pressure sensitive adhesive layer, and a heat-activatable adhesive layer; a release liner situated on the pressure sensitive adhesive layer of the tape (A); and an adhesive tape (B) comprising: a carrier layer, a release layer on one side of the carrier layer, and a pressure sensitive adhesive layer on the side of the carrier layer opposite the release layer and in direct contact with the heat-activatable adhesive layer of tape (A).

Also disclosed is a method for producing a composite system of this kind, and the specific use of the tape (B).

Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.