The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):

Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116  (1).

In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.

A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

A solvent-less hybrid curable composition is prepared from grafting polyesters or polyamides onto a (meth)acrylic copolymer backbone. Besides the many benefits of a solvent-less system, the hybrid curable composition forms strong adhesion to polar substrates, widens the use temperatures, and enables faster processing speeds than conventional hybrid curable compositions. The solvent-less hybrid curable composition forms an optically clear single phase that is suitable as tapes and labels, or in electronic, optoelectronic, OLED and photovoltaic devices, and the like.

A sealing device has a waterproofing layer, a functional layer, and an adhesive layer coated on and at least partially covering the first major surface of the waterproofing layer opposite the side of the functional layer. Also, a method produces a sealing device, a method waterproofs a substrate, and the use of the sealing device seals lapped joints formed between overlapping portions of waterproofing membranes and patches breaches in waterproofing membranes.

An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder component; and E) a photoinitiator component. The adhesive composition is useful for forming an adhesive. In various embodiments, the adhesive composition is in the form of a stick. The adhesive composition is useful for securing a fastener (e.g. in a borehole).

Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

A UV-cured exothermic self-adhesive repair sheet having two components that may be combined in equal sizes. The first component comprises Polyester Resin (25-40%), Glass Fiber (15-25%), Styrene Monomer (<20%) and Inorganic Filler (25-40%). The second component comprises Acrylic Adhesive (75-95%) and Non-Woven Fabric (5-25%).

A reinforcing film comprises a pressure sensitive adhesive layer laminated and fixed on a principal surface of a film substrate. The pressure sensitive adhesive layer is formed of a photocurable composition containing a photocurable agent and a base polymer having a crosslinked structure. A frictional force of the pressure sensitive adhesive layer measured with a frictional force microscope at a frequency of 5 Hz is preferably 2 to 5 times a frictional force at a frequency of 0.1 Hz. After photocuring of the pressure sensitive adhesive layer, a frictional force of a photocured pressure sensitive adhesive layer measured with the frictional force microscope at a frequency of 5 Hz is preferably not less than 5 times a frictional force measured at a frequency of 0.1 Hz.