Provided are: a wafer processing temporary adhesive that is for temporarily adhering a wafer to a support and that comprises a thermosetting resin composition containing a non-functional organopolysiloxane; a wafer laminate; and a thin wafer manufacturing method.

A pressure-sensitive adhesive sheet capable of allowing a small electronic part to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet includes: a gas-generating layer; and a gas barrier layer arranged on at least one side of the gas-generating layer, wherein the gas barrier layer is a layer that is deformed through laser light irradiation of the pressure-sensitive adhesive sheet, wherein a thickness (μm) of a highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (1), and wherein the thickness (μm) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (2): 12546×EXP(−0.728×log.sub.10(Er×10.sup.6)) . . . (1); 18096×EXP(−0.949×log.sub.10(Er×10.sup.6)) . . . (2), where Er represents a modulus of elasticity (MPa) of the highly elastic portion of the gas barrier layer by a nanoindentation method at 25° C.

The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to electromagnetic energy. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

A roofing underlayment capable of adhering to a roof deck comprising: (a) a roofing membrane having a first and a second major surface; and (b) a pressure-sensitive adhesive disposed on the first major surface of the roofing membrane and comprising: (i) at least one of butyl rubber or polyisobutylene; (ii) a first liquid plasticizer, preferably polybutene; and (iii) a tackifier, wherein the Tg of the adhesive is at most about 100 C. The adhesive provides high bond strength and excellent long-term heat aging, weathering resistance, as well as good low temperature properties while providing a moisture proof seam. A method for making the roofing underlayment includes applying the adhesive to the membrane then applying a release liner over the adhesive layer. A method for using the roofing underlayment comprises removing the release liner then adhering the underlayment to the roof deck by contacting the first to the roof deck.

The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.