The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L.sup.1 and L.sup.2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L.sup.1 and that of the alkyl group L.sup.2 is 6 or less) in an amount of 80 mass % or more.

##STR00001##

Release layers that include an oligomeric component comprising a unit of the Formula (I) are useful for releasably transferring components from one surface to another during manufacturing of microelectronic devices.

Embodiments provide methods of assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The portion of the minor component is coupled with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The composition is converted to the adhesive to form the apparel product. The adhesive includes a material having a boronate ester bond.

The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt. % of a) at least one ethylenically unsaturated non-ionic monomer; from 0.9 to 50 wt. % of b) at least one polymerizable ionic compound, wherein said polymerizable ionic compound comprises: b1) at least one compound in accordance with general formula IV; and/or b2) at least one compound in accordance with general formula V; and, from 0.1 to 10 wt. % of c) at least one free radical initiator.

##STR00001##

A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a heat-expandable agent. In the second step, an energy ray (R) is irradiated from the pressure-sensitive adhesive layer (10)-side of the bonded product (100) toward the adherend (20). A transmittance of the energy ray (R) in the pressure-sensitive adhesive layer (10) is 60% or more. The pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.

The present invention relates to an adhesive composition containing a polymer and an ionic liquid, in which an exudation amount of the ionic liquid is 0.002 mg/cm.sup.2 or more when an adhesive layer formed of the adhesive composition is allowed to adhere to an adherend and then is debonded after applying a voltage of 10 V for 10 seconds.

Embodiments provide methods for assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The methods include applying the portion of the minor component with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The methods include converting the composition to the adhesive to form the apparel product. The adhesive includes a material having a thioester bond.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

The present invention relates to a method for applying a threadlike adhesive body to an adherend so that the applied threadlike adhesive body has a desired shape, the method including a step in which a temporary-support-supported threadlike adhesive body including a temporary support and the threadlike adhesive body applied thereto so as to have a shape reverse to the desired shape is applied by press-bonding a surface thereof where the threadlike adhesive body lies to the adherend.