An adhesive element including a cover layer and a self-adhering sealant, wherein the self-adhering sealant is a thermoactive or thermoactivated rubber compound.

A method of manufacturing an article of jewelry with a druzy or geode effect, the method including: forming an adhesion mixture by mixing metal particles with a silica, shell, and/or clay with polymer, optionally in a liquid to form an adhesion paste; applying the adhesion mixture to an article of jewelry; applying a plurality of gemstones to the applied adhesion mixture to form a gemstone layer; melting the adhesion mixture without significantly melting the article of jewelry; and cooling the adhesion mixture to bond the gemstone layer to the article of jewelry.

An article is provided. The article includes an acrylate layer; a substrate overlaying the acrylate layer; and an adhesive layer between the acrylate layer and the substrate, wherein the adhesive layer includes germanium; wherein a release value between the acrylate layer and the adhesive layer is more than 200 g/inch.

A protein adhesive of a novel sequence is disclosed. The protein adhesive according to the present disclosures enables adhesion between two non-biological materials or between a non-biological material and a biological material, thereby being applicable to various fields.

An adhesive/sealant material for induction heating including copolymer of ethylene and butyl acrylate and a metallic filler. The metallic filler may be present in an amount of at least about 30% by weight of the adhesive/sealant material.

A method for making an oil- and water-resistant nanocomposite material includes preparing F-doped TiO.sub.2 nanorods, dispersing the F-doped TiO.sub.2 nanorods into a transparent adhesive to obtain a nanocomposite adhesive, and treating a surface of the nanocomposite adhesive to roughen the surface and expose some of the F-doped TiO.sub.2 nanorods. A transparent nanocomposite material suitable for use as transparent packaging for example is thereby obtained. The present disclosure also provides the nanocomposite material, and an encapsulating structure using the nanocomposite material.

Conductive adhesive compositions, jettable ink adhesive compositions, printed electronics incorporating the conductive adhesive compositions, and methods for preparing the same are provided. The conductive adhesive composition may include a eutectic metal alloy, an amine, and a solvent, and the eutectic metal alloy may include gallium, indium, and optionally tin.

The present invention relates to a thermally conductive adhesive composition having excellent mechanical properties and a method of manufacturing the same. Further, the present invention relates to method of manufacturing an article comprising the thermally conductive adhesive composition and articles obtainable by the described method.

There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60 C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60 C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.