Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.

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A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

A surface covering system includes a scrimless woven textile surface covering and an adhesive composition. The adhesive composition includes a dextrin and a polymer and does not migrate down a wall while setting. The adhesive composition forms enough points of contact with the textile that the textile can be installed on and remain installed on a wall. Upon removal of the covering, the adhesive composition adheres to the wall and little or no covering remains adhered to the composition.

A surface covering system includes a scrimless woven textile surface covering and an adhesive composition. The adhesive composition includes a dextrin and a polymer and does not migrate down a wall while setting. The adhesive composition forms enough points of contact with the textile that the textile can be installed on and remain installed on a wall. Upon removal of the covering, the adhesive composition adheres to the wall and little or no covering remains adhered to the composition.

A dispenser dispenses a material that is adhesive on at least one side, wherein at least one adhesive side of the material is covered with a liner, which has at least one slit running in a longitudinal direction, with the material placed on the liner being wound into a roll in the form of an Archimedean spiral and at least one slit being located beneath the material covered with the liner. The dispenser comprises a (i) frame, one end of which has a receptacle for the material, so that the material roll is rotatably mounted, (ii) a first guiding device, by means of which the material is guided together with the liner to a first dispensing edge, at which at least a first liner strip is pulled off, with the liner being separated at the slit located under the material, while the material with the remaining second liner strip is guided to a second dispensing edge, and (iii) a second guiding device, by means of which the material, together with the remaining liner strips, is guided to a second dispensing edge, at which the remaining second liner strip can be pulled off.

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E-04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E-04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

The present invention provides the dental primer for modifying surface of a dental restoration, comprising: an organic solvent, a silane coupling agent and a weakly acidic compound.

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

The present disclosure generally relates to an anti-spoiling, freshness-preserving formulation comprising ionized salt, method for making ionized salt for extending shelf life of fruit and the like. The method comprises treating a refine salt to form a salt crystal, diluting the salt crystal in a bath of essential oil to from a salt melt, ionizing the salt melt to form ionized salt and locking the ionized salt in a solid state.