Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×10.sup.4 to 1.0×10.sup.10Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm.sup.2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

A pressure-sensitive adhesive tape (10) has a base material (11), and a pressure-sensitive adhesive layer (20) provided on the surface (11A) of the base material (11) and containing cells (21) in the inside thereof, wherein the cells (21) include first cells (21A) contacting with the surface (11A) of the base material (11) and second cells (21B) disposed at positions away from the surface (11A) of the base material (11). Thereby, even when the cells (21) are made to be much contained in the pressure-sensitive adhesive layer (20) and the amount of a pressure-sensitive adhesive is made small, a high pressure-sensitive adhesive performance of the pressure-sensitive adhesive tape (10) is retained.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

The invention relates to a curable volume expandable polymer composition comprising an organic acid component, wherein the organic acid component comprises a first organic acid, a second organic acid, and optionally one or more additional organic acids; wherein said polymer composition, when being heated to an activation of expansion temperature above room temperature, undergoes volume expansion. When the organic acid component is heated to the activation of expansion temperature, the first organic acid and/or the second organic acid and/or the optionally present one or more additional organic acids decarboxylate and thus release carbon dioxide. The polymer composition traps the thus released carbon dioxide thereby causing the polymer composition to undergo volume expansion.

The present disclosure is directed to a multilayer pressure sensitive adhesive (PSA) assembly, comprising at least one pressure sensitive adhesive layer and a polymeric foam layer, wherein the pressure sensitive adhesive layer comprises a pressure-sensitive adhesive composition comprising a reaction product of a polymerizable material comprising: a) 2-propylheptyl acrylate as a first monomer; and optionally b) a second monomer having an ethylenically unsaturated group. The present disclosure is also directed to a method of manufacturing such a multilayer PSA assembly.

The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.

The present invention provides: a porous adhesive film which is formed from an adhesive composition including (meth)acrylic copolymers having hydroxyl groups and alkylene glycol groups, and which has a modulus of less than approximately 30 kPa at 25° C. and a peel strength of approximately 700 gf/in or greater at 25° C.; an optical member comprising same; and an optical display device comprising same.

An adhesive composition including an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent, wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and a weight-average molecular weight of the acrylic resin is 50,000 or more.

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.