An adhesive tape includes a substrate [I] and an adhesive agent layer of a polyester adhesive agent provided on at least one of opposite surfaces of the substrate [I]. The substrate [I] is one selected from a polyolefin resin foam substrate, a urethane resin foam substrate, and an acrylic resin foam substrate. The polyester adhesive agent is made from a polyester adhesive agent composition [II] which contains a polyester resin (A) having a weight average molecular weight of 5,000 to 300,000, and having a structural unit derived from a polyol and a structural unit derived from a polyvalent carboxylic acid compound containing an aromatic structure-containing compound in a proportion of not greater than 80 mol %. The adhesive tape is excellent in adherence between a polyester adhesive agent layer and a polyolefin resin foam substrate, a urethane resin foam substrate, or an acrylic resin foam substrate.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.

A heat-resistant release liner for use on pressure-sensitive adhesives and which comprises an externally situated silicone release layer (SR); a layer system (POL) comprising, in each of its layers, based in each case on the total weight of the layer, a total of at least 50% by weight of one or more polyolefins, where the layer system (POL) comprises, based on the total weight of the layer system (POL), at least 60% by weight of polypropylene; and an externally situated layer (PER) comprising, based on the total weight of the layer (PER), at least 80% by weight of polyethylene,

where an adhesive bonds the layer (PER) to the next subsequent layer in the structure of the release liner.

A low cost, thick duct tape having a multi-layer adhesive system and methods for making the duct tape are disclosed. The duct tape includes a backing having a first major surface and an opposing second major surface, a reinforcing material applied to the second major surface of the backing, an inner adhesive layer applied to the reinforcing material opposite the backing, and an outermost adhesive layer applied to the composite adhesive layer. The inner adhesive layer includes a first adhesive and an extender dispersed in the first adhesive, and the outermost adhesive layer includes a second adhesive that may be the same or different than the first adhesive.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.