The present disclosure relates to a two-component polyurethane adhesive, based on a polyol component A and a polyisocyanate component B. The two-component polyurethane adhesive exhibits fast cure speed, good adhesion properties and good durability. The two-component polyurethane adhesive is developed for the adhesion adhesion of substrates, wherein the substrates are preferably selected from the group comprising sheet molding compounds (SMCs) and plastic substrates.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof,
characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M.sub.n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M.sub.n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.

The present invention relates to an adhesive sheet laminate which comprises a substrate layer composed of a thermoplastic resin composition (A) containing a polypropylene-based resin as a main component, an adhesive layer composed of a thermoplastic resin composition (B) containing a specific thermoplastic resin (b) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and a release layer composed of a thermoplastic resin composition (C) containing a specific thermoplastic resin (c) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and which has a tensile elastic modulus of 2000 MPa or more.

An adhesive-coated polymer substrate comprising (a) a polymer substrate containing or consisting of a thermoplastic polymer with a Vicat A50 softening point according to DIN EN ISO 306 of up to 220° C., and (b) an adhesive composition coated directly on at least one side of the polymer substrate, wherein the adhesive composition (b) is a UV-curable or UV-cured hot melt pressure sensitive adhesive (PSA) is disclosed. A process for the manufacture of the adhesive-coated polymer substrate as well as to the use thereof are also disclosed.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

Film stacks are described. In particular, film stacks including a base overlaminate film layer and a removeable skin layer disposed on the base overlaminate film layer are described. Because the removable skin layer develops haze before the point of irreversibly damaging the base overlaminate layer, the film stack can prevent unintentional overstretching when the film stack is stretched together.

An adhesive tape includes a composite membrane and an adhesive layer, where the composite membrane includes a substrate and a hardening layer provided on a surface of the substrate, and a hardness of the hardening layer is 3H to 9H. The adhesive tape provided in this application has both small thickness and high hardness, which increases volumetric energy density of the electrochemical apparatus and can further effectively avoid tape wrinkling of the electrochemical apparatus.

A laminated polypropylene-based film suitable for retort packaging having an exterior film, a barrier layer, and a sealing layer. The retort packaging film has a total composition including high levels of polyolefin-based polymers and polypropylene-based polymers such that the material can be processed efficiently in a polypropylene recycling process. Advantageously, the film retains the properties required to suitably withstand the retort process and produce a high-quality shelf-stable packaged product.

The present disclosure is directed to a thermoresponsive adhesive material. The material comprises a linear, phase-separated polymer having fluorinated polymer units and hydrophobic polymer units. The fluorinated polymer units and the hydrophobic polymer units are randomly ordered along the polymer. The hydrophobic polymer units include a first hydrophobic polymer unit and a second hydrophobic polymer unit. The first hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl groups or alkenyl groups has 16 to 20 carbon atoms. The second hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl or alkenyl groups of the second hydrophobic polymer unit has 5 to 14 carbon atoms. A peak adhesive strength of the thermoresponsive adhesive material is modifiable and reversible with a change in temperature. Methods of making thermoresponsive adhesive materials, methods employing thermoresponsive adhesive materials and self-adhesive objects that include thermoresponsive adhesive materials are also disclosed.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.