Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E(160)/E(40)) of the elastic modulus of the base layer at 160 C. to the elastic modulus of the base layer at 40 C. is RE0.01, and the elastic modulus E(40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

A colored adhesive tape (1), in particular a yellow, orange-colored, or black adhesive tape (1), preferably a cable wrapping tape, with a temperature class of at least T3 (LV 312), including a textile substrate with a polymer plastic substrate (4, 4a, 4b), on which an adhesive material (5, 5a, 5b) is applied. In order to improve the temperature stability of the tape, while maintaining advantageous properties, the color of at least a part of the substrate (4, 4a, 4b) is formed by the inherent color of the polymer plastic material. The tape is preferably substrate formed of a polymer plastic materials which are aromatic, nitrogen-containing polymers from the group of polyoxadiazoles (POD), polybenzobisoxazoles (PBO) or polybenzimidazoles (PBI) (4, 4a, 4b). The adhesive tape (1) may be used as a cable harness (3).