A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing agent through thermal decomposition. These flame retardant additives can be incorporated into the adhesive in levels of 10 to 30 percent by weight. These formulations are then placed on a polymeric flame retardant substrate in either a single-sided or double-sided form.

To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280 C. and at most 320 C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 m.

An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m.sup.2 and a loop stiffness value of 0.45 g/cm or more.

A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 m, the adhesive layer has a thickness of 0.1 to 10 m, the adhesive tape has a thickness of 30 m or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa.Math.mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members:

Strength to repel members (MPa.Math.mm)=tensile elastic modulus (MPa) of adhesive tapethickness (mm) of adhesive tape.

Embodiments provide a pressure-sensitive adhesive film having () a poly(meth)acrylimide-based resin film layer and () a pressure-sensitive adhesive agent layer in that order from the surface layer side and having a total light transmittance of 80% or higher. The pressure-sensitive adhesive film may further have () a hard coat layer on the surface layer side of the poly(meth)acrylimide-based resin film layer (). This hard coat layer () may comprise an active energy ray-curable resin composition that contains (A) 100 parts by mass of a polyfunctional (meth)acrylate; (B) 0.2-4 parts by mass of a compound having an alkoxysilyl group and a (meth)acryloyl group; (C) 0.05-3 parts by mass of organic titanium; and (D) 5-100 parts by mass of fine particles having an average particle diameter of 1-300 nm. This active energy ray-curable resin composition may further contain (E) 0.01-7 parts by mass of a water-repelling agent.

An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.

The purpose of the present invention is to provide a storage state in which a reactive compound layer can be stably maintained in a polymer film having a reactive compound layer on the surface. The film roll is obtained by winding together: a first polymer film having a reactive compound layer on the surface, and a second polymer film having a surface roughness (Ra) of 0.1 m or more and a modulus of elasticity of 300 MPa or more and 10 GPa or less. The film bundle is obtained by laminating the first and second polymer films. Preferably, storing the film roll and the film bundle at a low temperature enables a thin layer of a reactive compound to be stably maintained.

A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.